POWER – WikiChip Fuse

IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

David SchorFoundries, Process Technologies, Roadmaps, Server ProcessorsDecember 20, 2018 Tagged 7LPP, 7nm, Common Platform Alliance, EUV, IBM, POWER, POWER10, Samsung, Z

IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.

POWER9 Scales Up To 1.2 TB/s of I/O, Targets NVLink 3, OpenCAPI Memory for 2019

David SchorArchitectures, Floorplanning, Hot Chips 30, Interconnects, Server ProcessorsOctober 7, 2018 Tagged 14HP, 14nm, A-Bus, Centaur, Hot Chips, Hot Chips 30, IBM, NVLink, OpenCAPI, POWER, POWER9, PowerAXON, X-Bus

A look at the IBM POWER9 scale-up design recently disclosed at Hot Chips 30 and their plans for a 3rd POWER9 derivative for 2019.

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

David SchorSupercomputersJune 16, 2018 Tagged DoE, IBM, Nvidia, NVLink, ORNL, PCIe 4.0, POWER, Supercomputer

A look at the 200-petaFLOPS Summit supercomputer which was officially unveiled last Friday by Oak Ridge National Laboratory (ORNL).