Kaby Lake G – WikiChip Fuse

Circuit Design Hot Chips 30 Packaging

Hot Chips 30: Intel Kaby Lake G

September 9, 2018May 25, 2021 David Schor 14 nm, 2.5D packaging, 3D packaging, AMD, CPU, EMIB, GPU, Intel, Kaby Lake, Kaby Lake G, multi-chip package, Radeon Vega, x86

A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.