Hot Chips 30: Intel Kaby Lake G David SchorCircuit Design, Hot Chips 30, PackagingSeptember 9, 2018 Tagged 14nm, 2.5D packaging, 3D packaging, AMD, CPU, EMIB, GPU, Intel, Kaby Lake, Kaby Lake G, multi-chip package, Radeon Vega, x86 A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30. Pages: 1 2 Read more
