IEDM 2022: Did We Just Witness The Death Of SRAM?
IEDM 2022: Did we just witness the death of SRAM? While foundries continue to show strong logic transistor scaling, SRAM scaling has completely collapsed.
Read moreIEDM 2022: Did we just witness the death of SRAM? While foundries continue to show strong logic transistor scaling, SRAM scaling has completely collapsed.
Read moreAMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.
Read moreA look at AMD’s Zen CPU Complex (CCX), a fully independent and modular cluster of up to four cores that are incorporated into a full SoC to form complete products such as their Zeppelin die.
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