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Wednesday, September 27, 2023
Latest:
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Introduces A New Big Core, The Cortex-A720
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520
  • TSMC N3, And Challenges Ahead
  • A Look At AMD’s 3D-Stacked V-Cache
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N3E

Foundries IEDM 2022 Interconnects Process Technologies 

TSMC N3, And Challenges Ahead

May 27, 2023May 27, 2023 David Schor 2023 2023 Technology Symposium, 3 nm, IEDM, IEDM 2022, N3, N3B, N3E, TSMC, TSMC Technology Symposium

A Look At TSMC N3 Process

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Foundries IEDM 2022 

IEDM 2022: Did We Just Witness The Death Of SRAM?

December 14, 2022December 15, 2022 David Schor 3 nm, cache, IEDM, N3, N3B, N3E, SRAM, TSMC

IEDM 2022: Did we just witness the death of SRAM? While foundries continue to show strong logic transistor scaling, SRAM scaling has completely collapsed.

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Process Technologies 

N3E Replaces N3; Comes In Many Flavors

September 4, 2022September 4, 2022 David Schor 3 nm, FinFlex, N3, N3E, TSMC

TSMC outlines a number of 3-nanometer class node changes and flavors.

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Top Six Articles

  • A Look At Intel 4 Process Technology
  • TSMC N3, And Challenges Ahead
  • Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A
  • N3E Replaces N3; Comes In Many Flavors
  • IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects
  • IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery

Recent

  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor
  • Arm Introduces A New Big Core, The Cortex-A720

    Arm Introduces A New Big Core, The Cortex-A720

    May 28, 2023May 28, 2023 David Schor
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520

    Arm Launches Next-Gen Efficiency Core; Cortex-A520

    May 28, 2023May 28, 2023 David Schor
  • TSMC N3, And Challenges Ahead

    TSMC N3, And Challenges Ahead

    May 27, 2023May 27, 2023 David Schor
  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor

Random Picks

Goldmont Plus detailed, large improvements, setting the stage for a 32-core model

Goldmont Plus detailed, large improvements, setting the stage for a 32-core model

December 26, 2017May 25, 2021 David Schor
Intel’s Diamond Mesa Bridges The Gap Between ASIC and FPGA

Intel’s Diamond Mesa Bridges The Gap Between ASIC and FPGA

June 13, 2021June 13, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
DARPA ERI: HIVE and Intel PUMA Graph Processor

DARPA ERI: HIVE and Intel PUMA Graph Processor

August 4, 2019May 25, 2021 David Schor
Arm Unveils the Cortex-A78: When Less Is More

Arm Unveils the Cortex-A78: When Less Is More

May 26, 2020May 23, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Qualcomm introduces a new Vision Intelligence Platform

Qualcomm introduces a new Vision Intelligence Platform

April 12, 2018May 25, 2021 Matt Larson
Arm Ethos is for Ubiquitous AI At the Edge

Arm Ethos is for Ubiquitous AI At the Edge

February 6, 2020May 25, 2021 David Schor
IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery

IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery

January 6, 2019May 25, 2021 David Schor
Intel Talks 10nm DTCO, EUV Benefits

Intel Talks 10nm DTCO, EUV Benefits

June 22, 2021August 2, 2021 David Schor
Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

October 28, 2018May 25, 2021 David Schor
Intel Introduces 2nd Gen Neuromorphic Research Chip: Loihi 2 on Intel 4 EUV Process

Intel Introduces 2nd Gen Neuromorphic Research Chip: Loihi 2 on Intel 4 EUV Process

September 30, 2021September 30, 2021 David Schor
ASML Q4: NXE:3400C Machines Ramp; Strong Growth Due to EUV in 2020

ASML Q4: NXE:3400C Machines Ramp; Strong Growth Due to EUV in 2020

January 22, 2020May 25, 2021 David Schor

ARM WorldView All

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor

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