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  • Reincarnating The 6502 Using Flexible TFT Tech For IoT
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC
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  • EUV State, NXE:3600D, and Pellicle Readiness and Industrialization
  • Intel Launches 12th Gen Core Desktop Alder Lake Processors
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28nm

Architectures Circuit Design ISSCC 2020 Manycore Processors Server Processors 

CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

March 1, 2020May 25, 2021 David Schor 28nm, 65 nm, active interposer, CEA-Leti, chiplet, interconnects, interposer, ISSCC, ISSCC 2020, multi-chip package, STMicroelectronics

CEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.

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Foundries Process Technologies 

UMC Rolls Out 22-Nanometer

December 13, 2019May 25, 2021 David Schor 22 nm, 22ULL, 22ULP, 28nm, 40 nm, UMC

UMC says it has started rolling out its 22-nanometer planar process, offering a new lower-power and cost-sensitive migration path from existing 40nm and 28nm nodes.

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Hot Chips 30 Interconnects Process Technologies 

Nantero’s NRAM, A Universal Memory Candidate?

September 22, 2018May 25, 2021 David Schor 28nm, carbon nanotube, carbon nanotubes, CNTs, Nantero, non-volatile memory, NRAM, process technology, storage-class memory

Presented at Hot Chips 30, a look at Nantero’s NRAM, a high-performance carbon nanotube-based memory billed as a DRAM successor.

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Desktop Processors Mobile Processors Server Processors 

Zhaoxin launches their highest-performance Chinese x86 chips

January 21, 2018May 25, 2021 David Schor 28nm, China, HLMC, KaisHeng, KaiXian, TSMC, VIA Technologies, x86, Zhaoxin

Zhaoxin has launched the highest-performance domestic Chinese x86 chips based on the WuDaoKou microarchitecture. Zhaoxin new chips are a brand new SoC design featuring higher performance cores, a new DDR4 memory controller and integrated graphics.

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Top Six Articles

  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
  • The x86 Advanced Matrix Extension (AMX) Brings Matrix Operations; To Debut with Sapphire Rapids
  • TSMC 2021 Foundry Update: Foundry Roadmap
  • Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp
  • AMD 3D Stacks SRAM Bumplessly

Recent

  • Reincarnating The 6502 Using Flexible TFT Tech For IoT

    Reincarnating The 6502 Using Flexible TFT Tech For IoT

    May 8, 2022May 8, 2022 David Schor
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    February 20, 2022February 21, 2022 David Schor
  • Samsung-Esperanto Concept AI-SSD Prototype

    Samsung-Esperanto Concept AI-SSD Prototype

    November 21, 2021November 21, 2021 David Schor
  • EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

    EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

    November 20, 2021November 20, 2021 David Schor
  • Intel Launches 12th Gen Core Desktop Alder Lake Processors

    Intel Launches 12th Gen Core Desktop Alder Lake Processors

    October 27, 2021November 3, 2021 David Schor
  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node

    TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node

    October 26, 2021October 26, 2021 David Schor

Random Picks

Samsung M5 Core Details Show Up

Samsung M5 Core Details Show Up

November 21, 2019May 25, 2021 David Schor
Intel silently launches Knights Mill

Intel silently launches Knights Mill

December 18, 2017May 25, 2021 David Schor
AMD Launches Ryzen Pro 4000 Series

AMD Launches Ryzen Pro 4000 Series

May 7, 2020May 23, 2021 David Schor
Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
The Magnets Under the Icy Lake

The Magnets Under the Icy Lake

May 23, 2021July 8, 2021 David Schor

Random Tags

2.5D packaging 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 12nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 edge computing EMIB EUV FinFET Foveros GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel Launches Mainstream Cascade Lake Xeon W Workstation Processors

Intel Launches Mainstream Cascade Lake Xeon W Workstation Processors

October 7, 2019May 25, 2021 David Schor
Bitcoin giant Bitmain enters the AI market with the BM1680 neural processor

Bitcoin giant Bitmain enters the AI market with the BM1680 neural processor

November 8, 2017May 25, 2021 David Schor
GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

September 21, 2019June 11, 2021 David Schor
Intel Announces 10th Gen Core Processors Based On 10nm Ice Lake, Now Shipping

Intel Announces 10th Gen Core Processors Based On 10nm Ice Lake, Now Shipping

May 28, 2019May 25, 2021 David Schor
ARM Announces the Mali-C52 and Mali-C32 ISPs for Intelligent Vision Devices

ARM Announces the Mali-C52 and Mali-C32 ISPs for Intelligent Vision Devices

January 3, 2019May 25, 2021 David Schor
Intel Launches New Core X Enthusiasts Microprocessors; Doubles The Perf-Per-Dollar

Intel Launches New Core X Enthusiasts Microprocessors; Doubles The Perf-Per-Dollar

October 4, 2019May 25, 2021 David Schor
Intel Reveals Initial 9000-Series Coffee Lake SKUs

Intel Reveals Initial 9000-Series Coffee Lake SKUs

July 3, 2018May 25, 2021 David Schor

ARM WorldView All

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor
A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip
IEDM 2020 Interconnects Packaging Subscriber Only Content 

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor
Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700
Architectures Interconnects Network-on-Chip 

Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

May 25, 2021May 25, 2021 David Schor
Arm Launches The DSU-110 For New Armv9 CPU Clusters
Architectures Interconnects Mobile Processors 

Arm Launches The DSU-110 For New Armv9 CPU Clusters

May 25, 2021May 25, 2021 David Schor

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