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Thursday, June 1, 2023
Latest:
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Introduces A New Big Core, The Cortex-A720
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520
  • TSMC N3, And Challenges Ahead
  • A Look At AMD’s 3D-Stacked V-Cache
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28nm

Architectures Circuit Design ISSCC 2020 Manycore Processors Server Processors 

CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

March 1, 2020May 25, 2021 David Schor 28nm, 65 nm, active interposer, CEA-Leti, chiplet, interconnects, interposer, ISSCC, ISSCC 2020, multi-chip package, STMicroelectronics

CEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.

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Foundries Process Technologies 

UMC Rolls Out 22-Nanometer

December 13, 2019May 25, 2021 David Schor 22 nm, 22ULL, 22ULP, 28nm, 40 nm, UMC

UMC says it has started rolling out its 22-nanometer planar process, offering a new lower-power and cost-sensitive migration path from existing 40nm and 28nm nodes.

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Hot Chips 30 Interconnects Process Technologies 

Nantero’s NRAM, A Universal Memory Candidate?

September 22, 2018May 25, 2021 David Schor 28nm, carbon nanotube, carbon nanotubes, CNTs, Nantero, non-volatile memory, NRAM, process technology, storage-class memory

Presented at Hot Chips 30, a look at Nantero’s NRAM, a high-performance carbon nanotube-based memory billed as a DRAM successor.

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Desktop Processors Mobile Processors Server Processors 

Zhaoxin launches their highest-performance Chinese x86 chips

January 21, 2018May 25, 2021 David Schor 28nm, China, HLMC, KaisHeng, KaiXian, TSMC, VIA Technologies, x86, Zhaoxin

Zhaoxin has launched the highest-performance domestic Chinese x86 chips based on the WuDaoKou microarchitecture. Zhaoxin new chips are a brand new SoC design featuring higher performance cores, a new DDR4 memory controller and integrated graphics.

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Top Six Articles

  • TSMC N3, And Challenges Ahead
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • A Look At Intel 4 Process Technology
  • Arm Introduces A New Big Core, The Cortex-A720
  • Intel Launches 3rd Gen Ice Lake Xeon Scalable
  • TSMC 7nm HD and HP Cells, 2nd Gen 7nm, And The Snapdragon 855 DTCO

Recent

  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor
  • Arm Introduces A New Big Core, The Cortex-A720

    Arm Introduces A New Big Core, The Cortex-A720

    May 28, 2023May 28, 2023 David Schor
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520

    Arm Launches Next-Gen Efficiency Core; Cortex-A520

    May 28, 2023May 28, 2023 David Schor
  • TSMC N3, And Challenges Ahead

    TSMC N3, And Challenges Ahead

    May 27, 2023May 27, 2023 David Schor
  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor

Random Picks

Arm Makes Headway In HPC, Cloud

Arm Makes Headway In HPC, Cloud

November 13, 2019May 25, 2021 David Schor
ASML Starts NXE:3400C Shipment, But Supply Constraints Loom

ASML Starts NXE:3400C Shipment, But Supply Constraints Loom

October 17, 2019May 25, 2021 David Schor
Arm Launches The DSU-110 For New Armv9 CPU Clusters

Arm Launches The DSU-110 For New Armv9 CPU Clusters

May 25, 2021May 25, 2021 David Schor
MediaTek Announces The Helio P22, A New Premium Mid-Range SoC

MediaTek Announces The Helio P22, A New Premium Mid-Range SoC

May 25, 2018May 25, 2021 Matt Larson
TSMC Starts 5-Nanometer Risk Production

TSMC Starts 5-Nanometer Risk Production

April 6, 2019May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

December 10, 2019May 25, 2021 David Schor
Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor
Arm Launches New Neoverse N2 and V1 Server CPUs: 1.4x-1.5x IPC, SVE, and ARMv9

Arm Launches New Neoverse N2 and V1 Server CPUs: 1.4x-1.5x IPC, SVE, and ARMv9

April 27, 2021May 23, 2021 David Schor
AMD Launches Ryzen PRO 3000 Series

AMD Launches Ryzen PRO 3000 Series

October 3, 2019May 25, 2021 David Schor
NEC Refreshes SX-Aurora Vector Engine, Outlines Roadmap

NEC Refreshes SX-Aurora Vector Engine, Outlines Roadmap

November 30, 2019May 25, 2021 David Schor
Arm Introduces The Cortex-A715

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor
IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

December 21, 2017May 25, 2021 David Schor

ARM WorldView All

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor

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