TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications
InterconnectsPackagingProcess Technologies March 3, 2020 0
TSMC announces an enhancement to its CoWoS packaging technology with support for up to 2x the reticle size. The new technology is ready for next-generation 5-nanometer HPC applications.
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TSMC Digs Trenches In Search Of Higher Performance
IEDM 2019InterconnectsPackagingProcess Technologies December 14, 2019 0
TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs.
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TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging
PackagingProcess TechnologiesSEMICON West 2019VLSI 2019 July 28, 2019 3
An update on TSMC current and forthcoming logic process nodes as well as their next-generation advanced packaging technologies.
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TSMC Demonstrates A 7nm Arm-Based Chiplet Design for HPC
InterconnectsPackagingServer ProcessorsVLSI 2019 June 22, 2019 0
A look at a high-performance 7nm Arm-based chiplet architecture which was recently presented by TSMC at the 2019 VLSI Symposium.
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TSMC Details 5 nm
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TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications
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