MiM – WikiChip Fuse

TSMC Digs Trenches In Search Of Higher Performance

December 14, 2019 David Schor 0 Comments 2.5D packaging, CoWoS, DTC, IEDM, IEDM 2019, MiM, TSMC

TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs.