TSMC Digs Trenches In Search Of Higher Performance
IEDM 2019InterconnectsPackagingProcess Technologies December 14, 2019 0
TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs.
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Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029
IEDM 2019Process TechnologiesRoadmaps December 10, 2019 1
Intel’s process technology roadmap reveals decade-out plans, including a future 10nm+++ node and even a 1.4nm node heading into 2029.
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Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect
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A Look At Celerity’s Second-Gen 496-Core RISC-V Mesh NoC
