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  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Introduces A New Big Core, The Cortex-A720
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520
  • TSMC N3, And Challenges Ahead
  • A Look At AMD’s 3D-Stacked V-Cache
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IEDM 2019

Architectures Hot Chips 31 IEDM 2019 ISSCC 2020 

A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

April 5, 2020May 25, 2021 David Schor 10 nm, 22 nm, 22FFL, 3D packaging, Foveros, Intel, Lakefield, Sunny Cove, Tremont

A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.

Read more
Foundries IEDM 2019 ISSCC 2020 Process Technologies 

TSMC Details 5 nm

March 21, 2020May 25, 2021 David Schor 5 nm, 7 nm, EUV, N5, N5P, TSMC

TSMC details its 5-nanometer node for mobile and HPC applications. The process features the industry’s highest density transistors with a high-mobility channel and highest-density SRAM cells.

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IEDM 2019 Interconnects Packaging Process Technologies 

TSMC Digs Trenches In Search Of Higher Performance

December 14, 2019May 25, 2021 David Schor 2.5D packaging, CoWoS, DTC, IEDM, IEDM 2019, MiM, TSMC

TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs.

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IEDM 2019 Process Technologies Roadmaps 

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

December 10, 2019May 25, 2021 David Schor 1.4 nm, 10 nm, 10nm, 2 nm, 3 nm, 5 nm, 7 nm, Intel

Intel’s process technology roadmap reveals decade-out plans, including a future 10nm+++ node and even a 1.4nm node heading into 2029.

Read more

Top Six Articles

  • A Look At Intel 4 Process Technology
  • TSMC N3, And Challenges Ahead
  • Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
  • A look at Nvidia’s NVLink interconnect and the NVSwitch
  • VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

Recent

  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor
  • Arm Introduces A New Big Core, The Cortex-A720

    Arm Introduces A New Big Core, The Cortex-A720

    May 28, 2023May 28, 2023 David Schor
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520

    Arm Launches Next-Gen Efficiency Core; Cortex-A520

    May 28, 2023May 28, 2023 David Schor
  • TSMC N3, And Challenges Ahead

    TSMC N3, And Challenges Ahead

    May 27, 2023May 27, 2023 David Schor
  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor

Random Picks

AMD 3D Stacks SRAM Bumplessly

AMD 3D Stacks SRAM Bumplessly

June 7, 2021June 7, 2021 David Schor
Arm Ethos is for Ubiquitous AI At the Edge

Arm Ethos is for Ubiquitous AI At the Edge

February 6, 2020May 25, 2021 David Schor
A look at Nvidia’s NVLink interconnect and the NVSwitch

A look at Nvidia’s NVLink interconnect and the NVSwitch

May 6, 2018May 25, 2021 David Schor
Arm Unveils Next-Gen Armv9 Little Core: Cortex-A510

Arm Unveils Next-Gen Armv9 Little Core: Cortex-A510

May 25, 2021May 26, 2021 David Schor
Arm Unveils Next-Gen Armv9 Big Core: Cortex-A710

Arm Unveils Next-Gen Armv9 Big Core: Cortex-A710

May 25, 2021May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Photonics Chiplet Inches Towards Production

Photonics Chiplet Inches Towards Production

August 16, 2021August 22, 2021 David Schor
Intel silently launches Knights Mill

Intel silently launches Knights Mill

December 18, 2017May 25, 2021 David Schor
IBM Introduces Next-Gen Z  Mainframe: The z15; Wider Cores, More Cores, More Cache, Still 5.2 GHz

IBM Introduces Next-Gen Z Mainframe: The z15; Wider Cores, More Cores, More Cache, Still 5.2 GHz

September 14, 2019May 25, 2021 David Schor
The x86 Advanced Matrix Extension (AMX) Brings Matrix Operations; To Debut with Sapphire Rapids

The x86 Advanced Matrix Extension (AMX) Brings Matrix Operations; To Debut with Sapphire Rapids

June 29, 2020May 23, 2021 David Schor
X-Gene 3 gets a second chance at Ampere with a new 32-core 16nm ARM processor

X-Gene 3 gets a second chance at Ampere with a new 32-core 16nm ARM processor

February 5, 2018May 25, 2021 David Schor
Arm Unveils the Cortex-A78: When Less Is More

Arm Unveils the Cortex-A78: When Less Is More

May 26, 2020May 23, 2021 David Schor
GlobalFoundries 14HP process, a marriage of two technologies

GlobalFoundries 14HP process, a marriage of two technologies

March 2, 2018May 25, 2021 David Schor

ARM WorldView All

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor

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