IEDM 2019

TSMC Details 5 nm

Foundries IEDM 2019 ISSCC 2020 Process Technologies March 21, 2020 0

TSMC details its 5-nanometer node for mobile and HPC applications. The process features the industry’s highest density transistors with a high-mobility channel and highest-density SRAM cells.

TSMC Digs Trenches In Search Of Higher Performance

IEDM 2019 Interconnects Packaging Process Technologies December 14, 2019 0

TSMC leverages existing silicon in the CoWoS process to improve the power delivery system of high-performance applications through new, deep trench capacitors, codename iCAPs.

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

IEDM 2019 Process Technologies Roadmaps December 10, 2019 1

Intel’s process technology roadmap reveals decade-out plans, including a future 10nm+++ node and even a 1.4nm node heading into 2029.