WikiChip Fuse
Intel Launches Lakefield: An Experiment With Multiple New Technologies

Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.

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A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.

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Intel Unveils the Tremont Microarchitecture: Going After ST Performance

Intel unveils the Tremont microarchitecture, its next-generation low-power small x86 core.

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Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021

An outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.

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Intel Looks to Advanced 3D Packaging For More-than-Moore to Supplement 10- and 7-Nanometer Nodes

At the recent Intel Architecture Day, the company unveiled their latest advanced packaging technology called Foveros, a face-to-face three-dimensional (3D) die stacking packaging technology in an effort to assist with the slowing of Moore’s Law.

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