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Latest:
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Introduces A New Big Core, The Cortex-A720
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520
  • TSMC N3, And Challenges Ahead
  • A Look At AMD’s 3D-Stacked V-Cache
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HPC

Packaging Subscriber Only Content 

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor 2.5D packaging, 3D packaging, HPC, hybrid bonding, SoIC, SoIC_H, SRAM cube, subscriber only (general), TSMC

[Subscription] TSMC demonstrates SoIC_H for next-generation high-bandwidth HPC applications.

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Foundries Process Technologies Roadmaps Subscriber Only Content 

TSMC 2021 Foundry Update: Automotive, Networking, and HPC Roadmap

July 6, 2021July 6, 2021 David Schor 5 nm, 7 nm, HPC, N5A, N5HPC, N6RF, N7HPC, subscriber only (general)

A TSMC 2021 foundry update: automotive, networking, and HPC roadmap.

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Foundries Interconnects Packaging Process Technologies 

Intel Process Technology And Packaging Plans: 10nm in June, 7nm in 2021

May 11, 2019May 25, 2021 David Schor 10nm, 3D packaging, 7nm, EMIB, HPC, Lakefield

An outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.

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Supercomputers 

Cavium Takes ARM to Petascale with Astra

August 25, 2018May 25, 2021 David Schor ARM, ARMv8, Cavium, DoE, HPC, Marvell, Sandia, Supercomputers, ThunderX, ThunderX2, Vulcan

A look at the Astra supercomputer, the most powerful ARM-based supercomputer being built for Sandia National Labs.

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Server Processors Supercomputers 

A Look at Cavium’s New High-Performance ARM Microprocessors and the Isambard Supercomputer

June 3, 2018May 25, 2021 David Schor 16nm, ARM, ARMv8, Cavium, HPC, Marvell, ThunderX, ThunderX2, Vulcan

Reaching general availability, here is a look at Cavium’s new ThunderX2 family of high-performance ARM microprocessors for the data center.

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Top Six Articles

  • A Look At Intel 4 Process Technology
  • TSMC N3, And Challenges Ahead
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Introduces A New Big Core, The Cortex-A720
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

Recent

  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor
  • Arm Introduces A New Big Core, The Cortex-A720

    Arm Introduces A New Big Core, The Cortex-A720

    May 28, 2023May 28, 2023 David Schor
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520

    Arm Launches Next-Gen Efficiency Core; Cortex-A520

    May 28, 2023May 28, 2023 David Schor
  • TSMC N3, And Challenges Ahead

    TSMC N3, And Challenges Ahead

    May 27, 2023May 27, 2023 David Schor
  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor

Random Picks

IBM Doubles Its 14nm eDRAM Density, Adds Hundreds of Megabytes of Cache

IBM Doubles Its 14nm eDRAM Density, Adds Hundreds of Megabytes of Cache

March 8, 2020May 25, 2021 David Schor
Intel Pushes Out Flagship Premium Tiger Lake Mobile Chips

Intel Pushes Out Flagship Premium Tiger Lake Mobile Chips

May 13, 2021May 23, 2021 David Schor
TOP500 50th List Anniversary: A Visualized Breakdown

TOP500 50th List Anniversary: A Visualized Breakdown

November 14, 2017May 25, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor
Intel Launches Lakefield: An Experiment With Multiple New Technologies

Intel Launches Lakefield: An Experiment With Multiple New Technologies

June 15, 2020May 23, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

TOP500 50th List Anniversary: A Visualized Breakdown

TOP500 50th List Anniversary: A Visualized Breakdown

November 14, 2017May 25, 2021 David Schor
Intel Introduces Co-EMIB To Stitch Multiple 3D Die Stacks Together, Adds Omni-Directional Interconnects

Intel Introduces Co-EMIB To Stitch Multiple 3D Die Stacks Together, Adds Omni-Directional Interconnects

July 9, 2019May 25, 2021 David Schor
Hot Chips 30: Nvidia Xavier SoC

Hot Chips 30: Nvidia Xavier SoC

September 8, 2018May 25, 2021 David Schor
AMD Launches New Entry-Level Mobile ‘Dali’ Processors

AMD Launches New Entry-Level Mobile ‘Dali’ Processors

January 9, 2020May 25, 2021 David Schor
Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies

Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies

November 7, 2019May 25, 2021 David Schor
N3E Replaces N3; Comes In Many Flavors

N3E Replaces N3; Comes In Many Flavors

September 4, 2022September 4, 2022 David Schor
IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

December 20, 2018May 25, 2021 David Schor

ARM WorldView All

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor

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