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Sunday, June 26, 2022
Latest:
  • A Look At Samsung’s 4LPE Process
  • A Look At Intel 4 Process Technology
  • Samsung 17nm follows Intel 16
  • Reincarnating The 6502 Using Flexible TFT Tech For IoT
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC
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N5HPC

Foundries Process Technologies Roadmaps Subscriber Only Content 

TSMC 2021 Foundry Update: Automotive, Networking, and HPC Roadmap

July 6, 2021July 6, 2021 David Schor 5 nm, 7 nm, HPC, N5A, N5HPC, N6RF, N7HPC, subscriber only (general)

A TSMC 2021 foundry update: automotive, networking, and HPC roadmap.

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Top Six Articles

  • A Look At Intel 4 Process Technology
  • A Look At Samsung’s 4LPE Process
  • TSMC Details 5 nm
  • IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects
  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging

Recent

  • A Look At Samsung’s 4LPE Process

    A Look At Samsung’s 4LPE Process

    June 26, 2022June 26, 2022 David Schor
  • A Look At Intel 4 Process Technology

    A Look At Intel 4 Process Technology

    June 19, 2022June 20, 2022 David Schor
  • Samsung 17nm follows Intel 16

    Samsung 17nm follows Intel 16

    May 22, 2022May 22, 2022 David Schor
  • Reincarnating The 6502 Using Flexible TFT Tech For IoT

    Reincarnating The 6502 Using Flexible TFT Tech For IoT

    May 8, 2022May 8, 2022 David Schor
  • Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

    February 20, 2022February 21, 2022 David Schor
  • Samsung-Esperanto Concept AI-SSD Prototype

    Samsung-Esperanto Concept AI-SSD Prototype

    November 21, 2021November 21, 2021 David Schor

Random Picks

TSMC Demonstrates A 7nm Arm-Based Chiplet Design for HPC

TSMC Demonstrates A 7nm Arm-Based Chiplet Design for HPC

June 22, 2019May 25, 2021 David Schor
IBM Doubles Its 14nm eDRAM Density, Adds Hundreds of Megabytes of Cache

IBM Doubles Its 14nm eDRAM Density, Adds Hundreds of Megabytes of Cache

March 8, 2020May 25, 2021 David Schor
Intel Launches Desktop Xeon E, Their Fastest Entry-Level Workstation Processors

Intel Launches Desktop Xeon E, Their Fastest Entry-Level Workstation Processors

July 13, 2018May 25, 2021 David Schor
Intel Rolls Out Cascade Lake Xeon W Processors

Intel Rolls Out Cascade Lake Xeon W Processors

June 3, 2019May 25, 2021 David Schor
Fujitsu launches a deep learning accelerator for industrial apps

Fujitsu launches a deep learning accelerator for industrial apps

January 16, 2018May 25, 2021 Matt Larson

Random Tags

2.5D packaging 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 AVX-512 chiplet Coffee Lake Core i5 Core i7 Core i9 edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel Spring Hill: Morphing Ice Lake SoC Into A Power-Efficient Data Center Inference Accelerator

Intel Spring Hill: Morphing Ice Lake SoC Into A Power-Efficient Data Center Inference Accelerator

October 20, 2019May 25, 2021 David Schor
Intel Launches New Comet Lake 10th Gen Mobile Processors With More Cores, LPDDR4X Memory

Intel Launches New Comet Lake 10th Gen Mobile Processors With More Cores, LPDDR4X Memory

August 21, 2019May 25, 2021 David Schor
AMD Discloses Initial Zen 2 Details

AMD Discloses Initial Zen 2 Details

November 18, 2018May 25, 2021 David Schor
VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

August 4, 2018May 25, 2021 David Schor
A Look At Celerity’s Second-Gen 496-Core RISC-V Mesh NoC

A Look At Celerity’s Second-Gen 496-Core RISC-V Mesh NoC

January 12, 2020May 25, 2021 David Schor
Photonics Chiplet Inches Towards Production

Photonics Chiplet Inches Towards Production

August 16, 2021August 22, 2021 David Schor
Huawei Expands Kunpeng Server CPUs, Plans SMT, SVE For Next Gen

Huawei Expands Kunpeng Server CPUs, Plans SMT, SVE For Next Gen

May 3, 2019May 25, 2021 David Schor

ARM WorldView All

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor
A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip
IEDM 2020 Interconnects Packaging Subscriber Only Content 

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor
Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700
Architectures Interconnects Network-on-Chip 

Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

May 25, 2021May 25, 2021 David Schor
Arm Launches The DSU-110 For New Armv9 CPU Clusters
Architectures Interconnects Mobile Processors 

Arm Launches The DSU-110 For New Armv9 CPU Clusters

May 25, 2021May 25, 2021 David Schor

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