WikiChip Fuse
A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.

Read more
Intel Unveils the Tremont Microarchitecture: Going After ST Performance

Intel unveils the Tremont microarchitecture, its next-generation low-power small x86 core.

Read more
Intel Reveals 10nm Sunny Cove Core, a New Core Roadmap, and Teases Ice Lake Chips

Last week Intel disclosed initial details of their next-generation core microarchitecture, Sunny Cove, which will make it into future Ice Lake client and server chips among other products.

Read more
Intel discloses Tremont, a Goldmont Plus successor

Intel has disclosed a new “Tremont” microarchitecture along with the release of their latest architecture ISA programming reference.

Read more