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Monday, December 4, 2023
Latest:
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Introduces A New Big Core, The Cortex-A720
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520
  • TSMC N3, And Challenges Ahead
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3GAAE

Foundries Process Technologies Roadmaps 

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor 2 nm, 3 nm, 3GAAE, 3GAAP, 3GAE, 3GAP, 5LPE, GAAFET, nanosheet, Samsung, Samsung Foundry

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

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ARM TechCon 2018 Foundries Packaging Process Technologies 

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

October 28, 2018May 25, 2021 David Schor 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.

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Top Six Articles

  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
  • A Look At Intel 4 Process Technology
  • TSMC N3, And Challenges Ahead
  • A look at Nvidia’s NVLink interconnect and the NVSwitch
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • TSMC 5-Nanometer Update

Recent

  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor
  • Arm Introduces A New Big Core, The Cortex-A720

    Arm Introduces A New Big Core, The Cortex-A720

    May 28, 2023May 28, 2023 David Schor
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520

    Arm Launches Next-Gen Efficiency Core; Cortex-A520

    May 28, 2023May 28, 2023 David Schor
  • TSMC N3, And Challenges Ahead

    TSMC N3, And Challenges Ahead

    May 27, 2023May 27, 2023 David Schor
  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor

Random Picks

OCP Makes a Push for an Open Chiplet Marketplace

OCP Makes a Push for an Open Chiplet Marketplace

January 4, 2020May 25, 2021 David Schor
Intel Labs Builds A Neuromorphic System With 64 To 768 Loihi Chips: 8 Million To 100 Million Neurons

Intel Labs Builds A Neuromorphic System With 64 To 768 Loihi Chips: 8 Million To 100 Million Neurons

July 15, 2019May 25, 2021 David Schor
The Mesh Network For Next-Generation Neoverse Chips

The Mesh Network For Next-Generation Neoverse Chips

May 22, 2021May 23, 2021 David Schor
IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

December 20, 2018May 25, 2021 David Schor
A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

July 26, 2021July 26, 2021 David Schor
Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor
Hot Chips 33 Program: Alder Lake, Sapphire Rapids, Zen 3, Next-Gen Z, Neoverse N2, And Many More

Hot Chips 33 Program: Alder Lake, Sapphire Rapids, Zen 3, Next-Gen Z, Neoverse N2, And Many More

May 13, 2021May 23, 2021 David Schor
Intel launches 8th Gen Core with Radeon RX Vega Graphics

Intel launches 8th Gen Core with Radeon RX Vega Graphics

January 7, 2018May 25, 2021 David Schor
IBM Doubles Its 14nm eDRAM Density, Adds Hundreds of Megabytes of Cache

IBM Doubles Its 14nm eDRAM Density, Adds Hundreds of Megabytes of Cache

March 8, 2020May 25, 2021 David Schor
TOP500 50th List Anniversary: A Visualized Breakdown

TOP500 50th List Anniversary: A Visualized Breakdown

November 14, 2017May 25, 2021 David Schor
TSMC Details 5 nm

TSMC Details 5 nm

March 21, 2020May 25, 2021 David Schor

ARM WorldView All

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor

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