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QUEST, A TCI-Based 3D-Stacked SRAM Neural Processor

Attempting to address the memory bandwidth problem, the QUEST neural processor uses 3D-stacked SRAM dies along with ThruChip Interface wireless communication technology to deliver sufficiently high bandwidth to sustain peak processing performance.

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IEDM 2017: Sony’s 3-layer stacked CMOS image sensor technology

At the 2017 IEDM Sony presented their 3-layer stacked state-of-the-art CMOS image sensor (CIS) technology used to minimize rolling shutter distortions and greatly increase the read speed and thus fps through the use of DRAM for temporarily storing the pixel data.

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Intel to leverage EMIBs to create mobile processors with discrete AMD graphics

Intel has announced they will be introducing an 8th generation processor featuring a discrete AMD Radeon GPU along with HBM2. Using Intel’s new EMIB packaging interconnect technology, the single-chip solution provides higher performance while delivering a smaller form factor than comparable solutions.

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