Intel Talks 10nm DTCO, EUV Benefits
Intel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.
Read moreIntel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.
Read moreSamsung revealed more details of its 5LPE process technology which recently ramped, gave a roadmap status update along with new stop-gap nodes announcement.
Read moreA look at the current state of leading-edge foundries for the first quarter of 2021.
Read moreTSMC announces its intention to build and operate an advanced 5-nanometer fab in Arizona.
Read moreTSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of silicon.
Read moreTSMC details its 5-nanometer node for mobile and HPC applications. The process features the industry’s highest density transistors with a high-mobility channel and highest-density SRAM cells.
Read moreASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow.
Read more7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year.
Read moreUMC says it has started rolling out its 22-nanometer planar process, offering a new lower-power and cost-sensitive migration path from existing 40nm and 28nm nodes.
Read moreAn update on TSMC’s upcoming 5-nanometer process technology.
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