Your Chips and Semi News
TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of silicon.
Read more
TSMC details its 5-nanometer node for mobile and HPC applications. The process features the industry’s highest density transistors with a high-mobility channel and highest-density SRAM cells.
Read more
ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow.
Read more
7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year.
Read more
UMC says it has started rolling out its 22-nanometer planar process, offering a new lower-power and cost-sensitive migration path from existing 40nm and 28nm nodes.
Read more
An update on TSMC’s upcoming 5-nanometer process technology.
Read more
ASML sees strong demand for EUV systems as it starts shipping the new NXE:3400C systems to leading-edge foundries.
Read more
An outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.
Read more
IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.
Read more
Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.
Read more