Your Chips and Semi News
7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year.
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UMC says it has started rolling out its 22-nanometer planar process, offering a new lower-power and cost-sensitive migration path from existing 40nm and 28nm nodes.
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An update on TSMC’s upcoming 5-nanometer process technology.
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ASML sees strong demand for EUV systems as it starts shipping the new NXE:3400C systems to leading-edge foundries.
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An outline of Intel’s process technology and packaging plans including their 10nm and 7nm nodes as discussed at the company’s recent investor meeting.
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IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.
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Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.
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A look at GlobalFoundries 12nm Leading Performance technology, 12LP, an enhanced 14nm process. The process was recently presented at the 2018 Symposia on VLSI Technology and Circuits.
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Fujitsu is selling its semiconductor factory in Mie to Taiwanese pure-play United Microelectronics
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