SiFive Introduces A New Coprocessor Interface, Targets Custom Accelerators

SiFive introduces a new high-performance coprocessor interface targeting custom accelerators; scores design wins from Google, NASA.

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A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.

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