WikiChip Fuse

Our latest coverage from the chip architecture world, including announced and planned as well as recently launched products.

Architectures Neural Processors

Intel Introduces 2nd Gen Neuromorphic Research Chip: Loihi 2 on Intel 4 EUV Process

September 30, 2021September 30, 2021 David Schor

Intel introduces Loihi 2, its second-generation neuromorphic research chip. First chip fabricated on their Intel 4 EUV process, Loihi 2 brings faster processing and synaptic operations, new algorithm support, and increases the neurons count to 1 million.

Architectures Neural Processors Packaging Subscriber Only Content

Inside PFN’s AI Processor And The World’s Most Power-Efficient Supercomputer

September 20, 2021September 20, 2021 David Schor

[Subscriber Content] Inside Preferred Networks’ AI processor and the world’s most power-efficient supercomputer it powers.

Architectures Hot Chips 33 Linley Processor Conference Neural Processors

A Look At Qualcomm’s Data Center Inference Accelerator

September 12, 2021September 13, 2021 David Schor

A look at Qualcomm’s Data Center Inference Accelerator, the Cloud AI 100.

Architectures Data Processing Unit Subscriber Only Content

YouTube Accelerates Transcoding

August 21, 2021August 21, 2021 David Schor

Google accelerates YouTube and other video services with custom silicon.

Silicon Photonics Subscriber Only Content VLSI 2021

Photonics Chiplet Inches Towards Production

August 16, 2021August 22, 2021 David Schor 45 nm, 45RFSOI, Ayar Labs, chiplet, silicon photonics, subscriber only (general), TeraPHY, VLSI 2021

[Subscriber Content] Ayar Labs photonics chiplet inches towards production readiness

Packaging Subscriber Only Content

5th Gen CoWoS-S Extends 3 Reticle Size

August 2, 2021August 2, 2021 David Schor 2.5D packaging, CoWoS, HBM2e, HBM3, interposer, subscriber only (general), TSMC

TSMC’s 5th Generation CoWoS-S Extends 3 Reticle Size.

Packaging Roadmaps

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

July 26, 2021July 26, 2021 David Schor 3D packaging, die stacking, EMIB, Foveros, Intel

Intel unveils the Foveros Omni and Foveros Direct packaging technologies; which will be leveraging multiple base dies and hybrid bonding

Foundries Process Technologies Roadmaps

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

July 26, 2021July 26, 2021 David Schor Extreme Ultraviolet (EUV) Lithography, Intel, Intel 20A, Intel 3, Intel 4, Intel 7

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

Foundries Process Technologies Roadmaps

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

July 26, 2021July 26, 2021 David Schor 20 Å, GAA, Intel, Intel 20A, PowerVia, RibbonFET

Intel announces Intel 20Å Node which will feature RibbonFET devices, PowerVia, and is set to ramp 2024.

Neural Processors Subscriber Only Content

Inside Baidu’s In-House Neural Processor

July 11, 2021July 12, 2021 David Schor 14 nm, 14LPP, 2.5D packaging, Baidu, HBM, Kunlun, neural processors, subscriber only (general)

A peek inside Baidu’s in-house neural processor

Architectures Manycore Processors

A Look At The ET-SoC-1, Esperanto’s Massively Multi-Core RISC-V Approach To AI

July 10, 2021August 2, 2021 David Schor 7 nm, Esperanto, ET-Maxion, ET-Minion, ET-SoC-1, neural processors, RISC-V, TSMC

A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores.