WikiChip Fuse – Page 2 – Your Chips and Semi News

Hot Chips 30: IBM Details POWER9 Scale-Up

Hot Chips 30: Nvidia's Tegra Xavier

Samsung's 2nd Generation 7nm

IEDM 2017 ISSCC 2018: Intel's 10nm with cobalt interconnects

AMD’s Zen CPU Complex, Cache, and SMU

VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

David SchorProcess Technologies, VLSI 2018August 4, 2018 Tagged 7LPP, 7nm, EUV, process technology, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 2nd generation 7nm process that was recently disclosed at the 38th Symposium on VLSI Technology.

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Intel Opens AIB for DARPA’s CHIPS Program as a Royalty-Free Interconnect Standard for Chiplet Architectures

David SchorInterconnectsJuly 24, 2018 Tagged Advanced Interface Bus, AIB, DARPA, EMIB, Intel, interconnects, Packaging

At the DARPA 2018 ERI Summit, Intel announced their contribution of a royalty-free bus standard to DARPA’s CHIPS Program, allowing seamless communication between multiple packaged chiplets.

VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP

David SchorFoundries, Process Technologies, VLSI 2018July 22, 2018 Tagged 12LP, 12nm, 14LPP, 14nm, FinFET, GlobalFoundries, process technology

A look at GlobalFoundries 12nm Leading Performance technology, 12LP, an enhanced 14nm process. The process was recently presented at the 2018 Symposia on VLSI Technology and Circuits.

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Intel Launches Desktop Xeon E, Their Fastest Entry-Level Workstation Processors

David SchorDesktop Processors, Server ProcessorsJuly 13, 2018 Tagged Coffee Lake, Coffee Lake E, Intel, x86, Xeon E, Xeon E3

Intel has launched their fastest entry-level workstation microprocessors based on Coffee Lake.

Intel Reveals Initial 9000-Series Coffee Lake SKUs

David SchorDesktop ProcessorsJuly 3, 2018 Tagged 14nm, Coffee Lake, Core i3, Core i5, x86

Intel has revealed the specs for some of the initial 9000-series Coffee Lake SKUs.

VLSI 2018: Samsung’s 8nm 8LPP, a 10nm extension

David SchorProcess Technologies, VLSI 2018July 1, 2018 Tagged 10LPE, 10LPP, 10nm, 8LPP, 8nm, FinFET, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 8nm 8LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.

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VLSI 2018: Samsung’s 11nm nodelet, 11LPP

David SchorProcess Technologies, VLSI 2018June 30, 2018 Tagged 10nm, 11LPP, 11nm, 14nm, FinFET, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 11nm 11LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.

Fujitsu Semi Sells 300mm Mie Fabs

David SchorFoundriesJune 29, 2018 Tagged 300mm, 40nm, Fujitsu, Japan, MIFS

Fujitsu is selling its semiconductor factory in Mie to Taiwanese pure-play United Microelectronics

Qualcomm Refreshes Mid-Range Lines with the 632, 439, and 429

David SchorMobile ProcessorsJune 27, 2018 Tagged 12nm, 14LPP, 14nm, ARM, ARMv8, Qualcomm, SDM429, SDM439, SDM632, Snapdragon, Snapdragon 400, Snapdragon 600

Qualcomm has refreshed their mid-range lines with the new Snapdragons 632, 439, and 429 SoCs.

Fujitsu Completes Post-K ARM CPU Prototype

David SchorSupercomputersJune 24, 2018 Tagged ARM, ARMv8, Fujitsu, Supercomputers, SVE

Fujitsu has completed their Post-K ARM CPU prototype which will power RIKEN’s next-generation Post-K Computer.