Data Interface Bus (DIB)

Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies

November 7, 2019 David Schor 0 Comments 14 nm, 2.5D packaging, Advanced Interface Bus (AIB), Data Interface Bus (DIB), EMIB, FPGA, Intel, multi-chip package, Stratix 10

Intel launches the industry’s highest-capacity FPGA; 10-million LEs comprising two large FPGA dies interconnected using the company’s 2.5D EMIB packaging technology.