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Monday, December 4, 2023
Latest:
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Introduces A New Big Core, The Cortex-A720
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520
  • TSMC N3, And Challenges Ahead
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Data Interface Bus (DIB)

FPGAs Packaging 

Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies

November 7, 2019May 25, 2021 David Schor 14 nm, 2.5D packaging, Advanced Interface Bus (AIB), Data Interface Bus (DIB), EMIB, FPGA, Intel, multi-chip package, Stratix 10

Intel launches the industry’s highest-capacity FPGA; 10-million LEs comprising two large FPGA dies interconnected using the company’s 2.5D EMIB packaging technology.

Read more

Top Six Articles

  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
  • A Look At Intel 4 Process Technology
  • TSMC N3, And Challenges Ahead
  • A look at Nvidia’s NVLink interconnect and the NVSwitch
  • AMD 3D Stacks SRAM Bumplessly
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

Recent

  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor
  • Arm Introduces A New Big Core, The Cortex-A720

    Arm Introduces A New Big Core, The Cortex-A720

    May 28, 2023May 28, 2023 David Schor
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520

    Arm Launches Next-Gen Efficiency Core; Cortex-A520

    May 28, 2023May 28, 2023 David Schor
  • TSMC N3, And Challenges Ahead

    TSMC N3, And Challenges Ahead

    May 27, 2023May 27, 2023 David Schor
  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor

Random Picks

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor
A Look at Intel’s 10nm Std Cell as TechInsights Reports on the i3-8121U, finds Ruthenium

A Look at Intel’s 10nm Std Cell as TechInsights Reports on the i3-8121U, finds Ruthenium

June 15, 2018May 25, 2021 David Schor
Arm Updates Its Neoverse Roadmap: New BFloat16, SVE Support

Arm Updates Its Neoverse Roadmap: New BFloat16, SVE Support

September 22, 2020May 23, 2021 David Schor
OCP Makes a Push for an Open Chiplet Marketplace

OCP Makes a Push for an Open Chiplet Marketplace

January 4, 2020May 25, 2021 David Schor
Intel Introduces 2nd Gen Neuromorphic Research Chip: Loihi 2 on Intel 4 EUV Process

Intel Introduces 2nd Gen Neuromorphic Research Chip: Loihi 2 on Intel 4 EUV Process

September 30, 2021September 30, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Inside Baidu’s In-House Neural Processor

Inside Baidu’s In-House Neural Processor

July 11, 2021July 12, 2021 David Schor
Fujitsu Semi Sells 300mm Mie Fabs

Fujitsu Semi Sells 300mm Mie Fabs

June 29, 2018May 25, 2021 David Schor
Apple’s iMac Pro Xeon W are ready

Apple’s iMac Pro Xeon W are ready

December 24, 2017May 25, 2021 David Schor
AMD Announces 3rd Gen Ryzen Threadripper

AMD Announces 3rd Gen Ryzen Threadripper

November 8, 2019May 25, 2021 David Schor
TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications

TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications

March 3, 2020May 25, 2021 David Schor
Arm Updates Its Neoverse Roadmap: New BFloat16, SVE Support

Arm Updates Its Neoverse Roadmap: New BFloat16, SVE Support

September 22, 2020May 23, 2021 David Schor
A Look at Cavium’s New High-Performance ARM Microprocessors and the Isambard Supercomputer

A Look at Cavium’s New High-Performance ARM Microprocessors and the Isambard Supercomputer

June 3, 2018May 25, 2021 David Schor

ARM WorldView All

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor

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