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Wednesday, July 6, 2022
Latest:
  • Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
  • Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
  • Arm Unveils Next-Gen Flagship Core: Cortex-X3
  • Arm Introduces The Cortex-A715
  • GlobalWafers To Build A 1.2M WPM Factory In Sherman, Texas
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Data Interface Bus (DIB)

FPGAs Packaging 

Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies

November 7, 2019May 25, 2021 David Schor 14 nm, 2.5D packaging, Advanced Interface Bus (AIB), Data Interface Bus (DIB), EMIB, FPGA, Intel, multi-chip package, Stratix 10

Intel launches the industry’s highest-capacity FPGA; 10-million LEs comprising two large FPGA dies interconnected using the company’s 2.5D EMIB packaging technology.

Read more

Top Six Articles

  • Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
  • A Look At Intel 4 Process Technology
  • Arm Introduces The Cortex-A715
  • Arm Unveils Next-Gen Flagship Core: Cortex-X3
  • A Look At Samsung’s 4LPE Process
  • TSMC Details 5 nm

Recent

  • Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

    Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

    July 5, 2022July 5, 2022 David Schor
  • Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

    Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

    June 28, 2022June 28, 2022 David Schor
  • Arm Unveils Next-Gen Flagship Core: Cortex-X3

    Arm Unveils Next-Gen Flagship Core: Cortex-X3

    June 28, 2022June 28, 2022 David Schor
  • Arm Introduces The Cortex-A715

    Arm Introduces The Cortex-A715

    June 28, 2022June 29, 2022 David Schor
  • GlobalWafers To Build A 1.2M WPM Factory In Sherman, Texas

    GlobalWafers To Build A 1.2M WPM Factory In Sherman, Texas

    June 27, 2022June 27, 2022 David Schor
  • A Look At Samsung’s 4LPE Process

    A Look At Samsung’s 4LPE Process

    June 26, 2022June 26, 2022 David Schor

Random Picks

GlobalFoundries 14HP process, a marriage of two technologies

GlobalFoundries 14HP process, a marriage of two technologies

March 2, 2018May 25, 2021 David Schor
Ice Lake Brings A New CPU, GPU, IPU, and I/Os, To Follow By Tiger Lake Next Year

Ice Lake Brings A New CPU, GPU, IPU, and I/Os, To Follow By Tiger Lake Next Year

May 12, 2019May 25, 2021 David Schor
Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

May 25, 2021May 25, 2021 David Schor
DARPA ERI: How Ayar Labs Collaboration With GF Produces A Photonics Chiplet That Can Supercharge Intel FPGAs

DARPA ERI: How Ayar Labs Collaboration With GF Produces A Photonics Chiplet That Can Supercharge Intel FPGAs

July 20, 2019May 25, 2021 David Schor
TSMC 2021 Foundry Update: Automotive, Networking, and HPC Roadmap

TSMC 2021 Foundry Update: Automotive, Networking, and HPC Roadmap

July 6, 2021July 6, 2021 David Schor

Random Tags

2.5D packaging 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen Zen 2

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel discloses Tremont, a Goldmont Plus successor

Intel discloses Tremont, a Goldmont Plus successor

April 4, 2018May 25, 2021 David Schor
Wave to acquire MIPS

Wave to acquire MIPS

June 13, 2018May 25, 2021 David Schor
WikiChip Fuse Moves to a Decaying Paywall Model

WikiChip Fuse Moves to a Decaying Paywall Model

May 13, 2021May 23, 2021 David Schor
Fujitsu Semi Sells 300mm Mie Fabs

Fujitsu Semi Sells 300mm Mie Fabs

June 29, 2018May 25, 2021 David Schor
Intel, AMD Add New Mobile Pro Processors

Intel, AMD Add New Mobile Pro Processors

April 16, 2019May 25, 2021 David Schor
Hot Chips 33 Program: Alder Lake, Sapphire Rapids, Zen 3, Next-Gen Z, Neoverse N2, And Many More

Hot Chips 33 Program: Alder Lake, Sapphire Rapids, Zen 3, Next-Gen Z, Neoverse N2, And Many More

May 13, 2021May 23, 2021 David Schor
Samsung M5 Core Details Show Up

Samsung M5 Core Details Show Up

November 21, 2019May 25, 2021 David Schor

ARM WorldView All

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor

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