Skip to content
Friday, August 12, 2022
Latest:
  • Samsung Foundry On EUV, Pellicles, Capacity, and Yield
  • Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
  • Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
  • Arm Unveils Next-Gen Flagship Core: Cortex-X3
  • Arm Introduces The Cortex-A715
WikiChip Fuse

WikiChip Fuse

Your Chips and Semi News

  • Home
  • Account
  • Main Site
  • Architectures
    • x86
    • ARM
    • RISC-V
    • Power ISA
    • MIPS
  • Supercomputers
  • 14 nm
  • 12nm
  • 10nm
  • 7nm
  • 5nm

EUV

ARM TechCon 2018 Foundries Packaging Process Technologies 

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

October 28, 2018May 25, 2021 David Schor 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.

Read more
Process Technologies VLSI 2018 

VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

August 4, 2018May 25, 2021 David Schor 7LPP, 7nm, EUV, process technology, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 2nd generation 7nm process that was recently disclosed at the 38th Symposium on VLSI Technology.

Read more
IEDM 2017 Process Technologies 

IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV

December 21, 2017May 25, 2021 David Schor 7LP, 7nm, AMD, EUV, FinFET, GlobalFoundries, IBM, IEDM, IEDM 2017, process technology, SADP, SAQP

At the 2017 IEDM GlobalFoundries detailed their 7nm Leading Performance (7LP) process, an aggressively scaled version of their 14nm process optimized for next-generation mobile, SoC, and high-performance applications.

Read more
Process Technologies 

Samsung 2nd gen 10nm enters HVM, S3 fab ready for primetime

November 29, 2017May 25, 2021 David Schor 10LPP, 10nm, 7LPP, 7nm, 8LPP, 8nm, EUV, Samsung

Samsung has announced that its 2nd generation 10nm process has entered mass production. The company also announced that their S3-Line fab in South Korea is ready to ramp up production.

Read more
  • Next →

Top Six Articles

  • Arm Unveils Next-Gen Flagship Core: Cortex-X3
  • A Look At Intel 4 Process Technology
  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • GlobalFoundries 14HP process, a marriage of two technologies
  • Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A
  • TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging

Recent

  • Samsung Foundry On EUV, Pellicles, Capacity, and Yield

    Samsung Foundry On EUV, Pellicles, Capacity, and Yield

    July 25, 2022July 25, 2022 David Schor
  • Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

    Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

    July 5, 2022July 5, 2022 David Schor
  • Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

    Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

    June 28, 2022June 28, 2022 David Schor
  • Arm Unveils Next-Gen Flagship Core: Cortex-X3

    Arm Unveils Next-Gen Flagship Core: Cortex-X3

    June 28, 2022June 28, 2022 David Schor
  • Arm Introduces The Cortex-A715

    Arm Introduces The Cortex-A715

    June 28, 2022June 29, 2022 David Schor
  • GlobalWafers To Build A 1.2M WPM Factory In Sherman, Texas

    GlobalWafers To Build A 1.2M WPM Factory In Sherman, Texas

    June 27, 2022June 27, 2022 David Schor

Random Picks

X-Gene 3 gets a second chance at Ampere with a new 32-core 16nm ARM processor

X-Gene 3 gets a second chance at Ampere with a new 32-core 16nm ARM processor

February 5, 2018May 25, 2021 David Schor
Radeon RX 5700: Navi and the RDNA Architecture

Radeon RX 5700: Navi and the RDNA Architecture

February 23, 2020May 25, 2021 David Schor
TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node

TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node

October 26, 2021October 26, 2021 David Schor
Intel Labs Builds A Neuromorphic System With 64 To 768 Loihi Chips: 8 Million To 100 Million Neurons

Intel Labs Builds A Neuromorphic System With 64 To 768 Loihi Chips: 8 Million To 100 Million Neurons

July 15, 2019May 25, 2021 David Schor
GlobalWafers To Build A 1.2M WPM Factory In Sherman, Texas

GlobalWafers To Build A 1.2M WPM Factory In Sherman, Texas

June 27, 2022June 27, 2022 David Schor

Random Tags

2.5D packaging 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen Zen 2

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Qualcomm Launches The Snapdragon 710, A New Premium Mid-Range SoC

Qualcomm Launches The Snapdragon 710, A New Premium Mid-Range SoC

May 25, 2018May 25, 2021 David Schor
Intel Cascade Lake Brings Hardware Mitigations, AI Acceleration, SCM Support

Intel Cascade Lake Brings Hardware Mitigations, AI Acceleration, SCM Support

November 11, 2018May 25, 2021 David Schor
A look at Nvidia’s NVLink interconnect and the NVSwitch

A look at Nvidia’s NVLink interconnect and the NVSwitch

May 6, 2018May 25, 2021 David Schor
Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

July 26, 2021July 26, 2021 David Schor
Forschungszentrum Jülich is upgrading its computing power

Forschungszentrum Jülich is upgrading its computing power

January 23, 2018May 25, 2021 Matt Larson
Samsung Foundry On EUV, Pellicles, Capacity, and Yield

Samsung Foundry On EUV, Pellicles, Capacity, and Yield

July 25, 2022July 25, 2022 David Schor
Radeon RX 5700: Navi and the RDNA Architecture

Radeon RX 5700: Navi and the RDNA Architecture

February 23, 2020May 25, 2021 David Schor

ARM WorldView All

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor

About

WikiChip
WikiChip is an independent publisher based in New York. The WikiChip Fuse section publishes chips and semiconductor related news with our main site offering in-depth semiconductor resources and analysis.

WikiChip Links

  • Main Site
  • WikiChip Fuse
  • Newsletter
  • Main Site
  • WikiChip Fuse

Copyright © 2022 WikiChip LLC. All rights reserved.