David Schor

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor Alder Lake, Golden Cove, Intel, Intel 7, Sapphire Rapids, x86

Intel details Golden Cove, the company’s next-generation big core for client and server SoCs

Silicon Photonics Subscriber Only Content VLSI 2021

Photonics Chiplet Inches Towards Production

August 16, 2021August 22, 2021 David Schor 45 nm, 45RFSOI, Ayar Labs, chiplet, silicon photonics, subscriber only (general), TeraPHY, VLSI 2021

[Subscriber Content] Ayar Labs photonics chiplet inches towards production readiness

Packaging Subscriber Only Content

5th Gen CoWoS-S Extends 3 Reticle Size

August 2, 2021August 2, 2021 David Schor 2.5D packaging, CoWoS, HBM2e, HBM3, interposer, subscriber only (general), TSMC

TSMC’s 5th Generation CoWoS-S Extends 3 Reticle Size.

Packaging Roadmaps

Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding

July 26, 2021July 26, 2021 David Schor 3D packaging, die stacking, EMIB, Foveros, Intel

Intel unveils the Foveros Omni and Foveros Direct packaging technologies; which will be leveraging multiple base dies and hybrid bonding

Foundries Process Technologies Roadmaps

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

July 26, 2021July 26, 2021 David Schor Extreme Ultraviolet (EUV) Lithography, Intel, Intel 20A, Intel 3, Intel 4, Intel 7

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

Foundries Process Technologies Roadmaps

Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp

July 26, 2021July 26, 2021 David Schor 20 Å, GAA, Intel, Intel 20A, PowerVia, RibbonFET

Intel announces Intel 20Å Node which will feature RibbonFET devices, PowerVia, and is set to ramp 2024.

Neural Processors Subscriber Only Content

Inside Baidu’s In-House Neural Processor

July 11, 2021July 12, 2021 David Schor 14 nm, 14LPP, 2.5D packaging, Baidu, HBM, Kunlun, neural processors, subscriber only (general)

A peek inside Baidu’s in-house neural processor

Architectures Manycore Processors

A Look At The ET-SoC-1, Esperanto’s Massively Multi-Core RISC-V Approach To AI

July 10, 2021August 2, 2021 David Schor 7 nm, Esperanto, ET-Maxion, ET-Minion, ET-SoC-1, neural processors, RISC-V, TSMC

A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores.

Circuit Design Foundries ISSCC 2021 Process Technologies Roadmaps Subscriber Only Content VLSI 2021

Samsung 3nm GAA Inches Towards Productization With SRAM, SoC Test Vehicles

July 8, 2021July 8, 2021 David Schor 3 nm, GAA, Samsung, Samsung Foundry, subscriber only (general)

Samsung tapes out 3nm GAA test vehicle as it inches towards mass production

Foundries Process Technologies Roadmaps Subscriber Only Content

TSMC 2021 Foundry Update: Automotive, Networking, and HPC Roadmap

July 6, 2021July 6, 2021 David Schor 5 nm, 7 nm, HPC, N5A, N5HPC, N6RF, N7HPC, subscriber only (general)

A TSMC 2021 foundry update: automotive, networking, and HPC roadmap.