A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.

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AMD 3D Stacks SRAM Bumplessly

AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.

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