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Friday, October 10, 2025

Latest:

Arm Launches Next-Gen Big-Core: Cortex-A725
Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
Arm Launches Next-Gen Flagship Cortex-X925
Amazon Debuts 4th Gen Graviton
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

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Cascade Lake X

Desktop Processors

Intel Launches New Core X Enthusiasts Microprocessors; Doubles The Perf-Per-Dollar

October 4, 2019May 25, 2021 David Schor 14 nm, Cascade Lake, Cascade Lake X, Core i9, Core X, Intel

Intel launches new 10000 series Core X processors for enthusiasts with up to 18 cores and with double the performance per dollar compared to the last generation.

Top Six Articles

Arm Launches Next-Gen Flagship Cortex-X925
TSMC Talks 7nm, 5nm, Yield, And Next-Gen 5G And HPC Packaging
Arm Launches New Neoverse N2 and V1 Server CPUs: 1.4x-1.5x IPC, SVE, and ARMv9
TSMC N3, And Challenges Ahead
The Mesh Network For Next-Generation Neoverse Chips
Arm Targets Data Centers with New Roadmaps, Architectures, and Standards

Recent

Arm Launches Next-Gen Big-Core: Cortex-A725
May 29, 2024May 29, 2024 David Schor
Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
May 28, 2023May 28, 2023 David Schor

Random Picks

Intel’s Total Memory Encryption, a new x86 extension for full memory encryption

December 17, 2017May 25, 2021 David Schor

Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and 112G Transceivers

April 2, 2019May 25, 2021 David Schor

TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

April 17, 2020May 25, 2021 David Schor

OCP Bunch of Wires: A New Open Chiplets Interface For Organic Substrates

January 5, 2020May 25, 2021 David Schor

ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging

March 24, 2018May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Desktop Processors Mobile Processors

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Architectures Server Processors

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor

Architectures Data Processing Unit Desktop Processors Mobile Processors

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor

Architectures Desktop Processors Mobile Processors

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor

Architectures Desktop Processors Mobile Processors Server Processors

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor

Architectures Server Processors

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

TSMC 2021 Foundry Update: Foundry Roadmap

July 6, 2021July 6, 2021 David Schor

Intel Launches 10th Gen Ice Lake Lineup: 11 New Mobile Chips

August 1, 2019May 25, 2021 David Schor

Core i7-8700K overclockability silicon lottery stats

November 12, 2017May 25, 2021 David Schor

TSMC Starts 5-Nanometer Risk Production

April 6, 2019May 25, 2021 David Schor

ASML Starts NXE:3400C Shipment, But Supply Constraints Loom

October 17, 2019May 25, 2021 David Schor

TSMC Digs Trenches In Search Of Higher Performance

December 14, 2019May 25, 2021 David Schor

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

December 10, 2019May 25, 2021 David Schor

ARM WorldView All

Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor

Architectures Desktop Processors Embedded Processors Mobile Processors

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor

Architectures Desktop Processors Server Processors

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor

Server Processors

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor

Embedded Processors Mobile Processors

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor

Architectures Desktop Processors Mobile Processors Server Processors

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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