Bunch of Wires (BoW)

OCP Bunch of Wires: A New Open Chiplets Interface For Organic Substrates

January 5, 2020May 25, 2021 David Schor Bunch of Wires (BoW), chiplet, Hot Interconnects, Hot Interconnects 26, multi-chip package, OCP Open Domain-Specific Architecture (ODSA), Open Compute Project (OCP)

A look at a Bunch of Wires, a new open standard chiplets interconnect being proposed by the OCP ODSA group intended for standard organic multi-chip packages as a cheaper alternative to silicon interposers and bridges.