3D V-Cache

Architectures Desktop Processors Interconnects Packaging

AMD 3D Stacks SRAM Bumplessly

June 7, 2021June 7, 2021 David Schor 3D packaging, 3D V-Cache, 7 nm, AMD, Direct Bond Interconnect (DBI), hybrid bonding, Ryzen, SRAM, System on Integrated Chips (SoIC)

AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.