Skip to content

Thursday, June 19, 2025

Latest:

Arm Launches Next-Gen Big-Core: Cortex-A725
Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
Arm Launches Next-Gen Flagship Cortex-X925
Amazon Debuts 4th Gen Graviton
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

WikiChip Fuse

Your Chips and Semi News

Home
Account
Main Site
Architectures
- x86
- ARM
- RISC-V
- Power ISA
- MIPS
Supercomputers
14 nm
12nm
10nm
7nm
5nm

Cannon Lake

Mobile Processors

Intel Silently Launches Cannon Lake

May 15, 2018May 25, 2021 David Schor 10nm, Cannon Lake, Intel, x86

Intel has silently launched the first 10nm-based Cannon Lake SKU.

Top Six Articles

TSMC N3, And Challenges Ahead
A Look At Intel 4 Process Technology
VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers
TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
Inside Tesla’s Neural Processor In The FSD Chip
Arm Launches New Neoverse N2 and V1 Server CPUs: 1.4x-1.5x IPC, SVE, and ARMv9

Recent

Arm Launches Next-Gen Big-Core: Cortex-A725
May 29, 2024May 29, 2024 David Schor
Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
May 28, 2023May 28, 2023 David Schor

Random Picks

Intel Announces Keem Bay: 3rd Generation Movidius VPU

November 12, 2019May 25, 2021 David Schor

AMD Announces 3rd Gen Ryzen Threadripper

November 8, 2019May 25, 2021 David Schor

Arm Updates Its Neoverse Roadmap: New BFloat16, SVE Support

September 22, 2020May 23, 2021 David Schor

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor

Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect

February 9, 2020May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Desktop Processors Mobile Processors

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Architectures Server Processors

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor

Architectures Data Processing Unit Desktop Processors Mobile Processors

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor

Architectures Desktop Processors Mobile Processors

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor

Architectures Desktop Processors Mobile Processors Server Processors

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor

Architectures Server Processors

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Fujitsu launches a deep learning accelerator for industrial apps

January 16, 2018May 25, 2021 Matt Larson

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

December 10, 2019May 25, 2021 David Schor

A Look At AMD’s 3D-Stacked V-Cache

December 27, 2022December 27, 2022 David Schor

Bitcoin giant Bitmain enters the AI market with the BM1680 neural processor

November 8, 2017May 25, 2021 David Schor

Fujitsu Semi Sells 300mm Mie Fabs

June 29, 2018May 25, 2021 David Schor

TSMC Announces 6-Nanometer Process

April 16, 2019May 25, 2021 David Schor

Intel Introduces 10nm Agilex FPGAs; Customized Connectivity with HBM, DDR5, PCIe Gen 5, and 112G Transceivers

April 2, 2019May 25, 2021 David Schor

ARM WorldView All

Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor

Architectures Desktop Processors Embedded Processors Mobile Processors

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor

Architectures Desktop Processors Server Processors

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor

Server Processors

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor

Embedded Processors Mobile Processors

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor

Architectures Desktop Processors Mobile Processors Server Processors

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

About

WikiChip is an independent publisher based in New York. The WikiChip Fuse section publishes chips and semiconductor related news with our main site offering in-depth semiconductor resources and analysis.

WikiChip Links

Main Site
WikiChip Fuse
Newsletter

Main Site
WikiChip Fuse

Copyright © 2025 WikiChip LLC. All rights reserved.