design-for-test

GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

September 21, 2019June 11, 2021 David Schor 12LP, 12nm, 3D packaging, ARM, CMN-600, design-for-test, Direct Bond Interconnect (DBI), GlobalFoundries, hybrid bonding, Trishul (Arm test chip)

GlobalFoundries and Arm demonstrate a 3D mesh interconnect design using highly-dense hybrid bonding 3D stacking technology intended for HPC applications.