active interposer

CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

March 1, 2020May 25, 2021 David Schor 28nm, 65 nm, active interposer, CEA-Leti, chiplet, interconnects, interposer, ISSCC, ISSCC 2020, multi-chip package, STMicroelectronics

CEA-Leti demonstrates a high-performance microprocessor architecture with a 96-core MIPS processor built with six chiplets 3D-stacked on an active interposer die.