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Sunday, March 26, 2023
Latest:
  • A Look At AMD’s 3D-Stacked V-Cache
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications
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Goldmont Plus

Architectures 

Goldmont Plus detailed, large improvements, setting the stage for a 32-core model

December 26, 2017May 25, 2021 David Schor 14 nm, Gemini Lake, Goldmont Plus, Intel, x86

Intel has finally detailed their recently launched Goldmont Plus microarchitecture and unlike what the name suggests, this is very far from a simple refresh.

Read more
Desktop Processors Mobile Processors 

Intel launches Gemini Lake

December 11, 2017May 25, 2021 David Schor 14 nm, Celeron, Gemini Lake, Goldmont Plus, Intel, Pentium, Pentium Silver, x86

Intel introduced their much anticipated low-power budget microprocessors codename Gemini Lake for budget embedded, mobile, and desktop devices based on the Goldmont Plus microarchitecture.

Read more

Top Six Articles

  • A Look At Intel 4 Process Technology
  • TSMC Extends Its 5nm Family With A New Enhanced-Performance N4P Node
  • Arm Introduces The Cortex-A715
  • Arm Introduces Its Confidential Compute Architecture
  • N3E Replaces N3; Comes In Many Flavors
  • Intel Reveals 10nm Sunny Cove Core, a New Core Roadmap, and Teases Ice Lake Chips

Recent

  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor
  • SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

    SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

    November 1, 2022November 2, 2022 David Schor
  • Intel, SiFive Demo High-Performance  RISC-V Horse Creek Dev Platform On Intel 4 Process

    Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

    October 7, 2022October 7, 2022 David Schor
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    October 4, 2022October 4, 2022 David Schor
  • Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    October 1, 2022October 3, 2022 David Schor

Random Picks

A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC

April 5, 2020May 25, 2021 David Schor
Arm Unveils Next-Gen Armv9 Little Core: Cortex-A510

Arm Unveils Next-Gen Armv9 Little Core: Cortex-A510

May 25, 2021May 26, 2021 David Schor
Intel launches the Xeon D-2100 series of low-power edge processors

Intel launches the Xeon D-2100 series of low-power edge processors

February 7, 2018May 25, 2021 David Schor
Intel Talks 10nm DTCO, EUV Benefits

Intel Talks 10nm DTCO, EUV Benefits

June 22, 2021August 2, 2021 David Schor
CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

March 1, 2020May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

AMD Launches New Entry-Level Mobile ‘Dali’ Processors

AMD Launches New Entry-Level Mobile ‘Dali’ Processors

January 9, 2020May 25, 2021 David Schor
Centaur Unveils Its New Server-Class x86 Core: CNS; Adds AVX-512

Centaur Unveils Its New Server-Class x86 Core: CNS; Adds AVX-512

December 9, 2019May 25, 2021 David Schor
8th Gen Coffee Lake and 9th Gen Lineup

8th Gen Coffee Lake and 9th Gen Lineup

November 24, 2017May 25, 2021 David Schor
Fujitsu Semi Sells 300mm Mie Fabs

Fujitsu Semi Sells 300mm Mie Fabs

June 29, 2018May 25, 2021 David Schor
Intel Labs Builds A Neuromorphic System With 64 To 768 Loihi Chips: 8 Million To 100 Million Neurons

Intel Labs Builds A Neuromorphic System With 64 To 768 Loihi Chips: 8 Million To 100 Million Neurons

July 15, 2019May 25, 2021 David Schor
Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality

Left, Right, Above, and Under: Intel 3D Packaging Tech Gains Omnidirectionality

May 17, 2020May 23, 2021 David Schor
Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies

Intel Launches Stratix 10 GX 10M; 10M LEs, Two Massive Interconnected Dies

November 7, 2019May 25, 2021 David Schor

ARM WorldView All

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor

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