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Wednesday, November 29, 2023
Latest:
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • Arm Introduces A New Big Core, The Cortex-A720
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520
  • TSMC N3, And Challenges Ahead
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Intel eASIC

Architectures FPGAs Subscriber Only Content 

Intel’s Diamond Mesa Bridges The Gap Between ASIC and FPGA

June 13, 2021June 13, 2021 David Schor 16 nm, Diamond Mesa, eASIC Nextreme, Intel, Intel eASIC, Structured ASIC, subscriber only (general)

With Intel’s acquisition of eASIC in 2018, the company’s latest product – codenamed Diamond Mesa – attempts to bridge the gap between full ASIC and FPGAs.

Read more

Top Six Articles

  • A Look At Intel 4 Process Technology
  • TSMC Details 5 nm
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
  • IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects
  • Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding
  • Arm Introduces A New Big Core, The Cortex-A720

Recent

  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor
  • Arm Introduces A New Big Core, The Cortex-A720

    Arm Introduces A New Big Core, The Cortex-A720

    May 28, 2023May 28, 2023 David Schor
  • Arm Launches Next-Gen Efficiency Core; Cortex-A520

    Arm Launches Next-Gen Efficiency Core; Cortex-A520

    May 28, 2023May 28, 2023 David Schor
  • TSMC N3, And Challenges Ahead

    TSMC N3, And Challenges Ahead

    May 27, 2023May 27, 2023 David Schor
  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor

Random Picks

IBM Releases Power ISA v3.1; To Present POWER10 At Hot Chips 32

IBM Releases Power ISA v3.1; To Present POWER10 At Hot Chips 32

May 23, 2020May 23, 2021 David Schor
Intel Introduces 2nd Gen Neuromorphic Research Chip: Loihi 2 on Intel 4 EUV Process

Intel Introduces 2nd Gen Neuromorphic Research Chip: Loihi 2 on Intel 4 EUV Process

September 30, 2021September 30, 2021 David Schor
Intel launches the Xeon D-2100 series of low-power edge processors

Intel launches the Xeon D-2100 series of low-power edge processors

February 7, 2018May 25, 2021 David Schor
Samsung 5 nm and 4 nm Update

Samsung 5 nm and 4 nm Update

October 19, 2019May 25, 2021 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

ORNL’s 200-petaFLOPS Summit Supercomputer Has Arrived, To Become World’s Fastest

June 16, 2018May 25, 2021 David Schor
A Look At AMD’s 3D-Stacked V-Cache

A Look At AMD’s 3D-Stacked V-Cache

December 27, 2022December 27, 2022 David Schor
IBM Doubles Its 14nm eDRAM Density, Adds Hundreds of Megabytes of Cache

IBM Doubles Its 14nm eDRAM Density, Adds Hundreds of Megabytes of Cache

March 8, 2020May 25, 2021 David Schor
Intel Expands 22FFL With Production-Ready RRAM and MRAM on FinFET

Intel Expands 22FFL With Production-Ready RRAM and MRAM on FinFET

October 18, 2019May 25, 2021 David Schor
Arm Launches Its New Flagship Performance Armv9 Core: Cortex-X2

Arm Launches Its New Flagship Performance Armv9 Core: Cortex-X2

May 25, 2021May 25, 2021 David Schor
Intel Announces Keem Bay: 3rd Generation Movidius VPU

Intel Announces Keem Bay: 3rd Generation Movidius VPU

November 12, 2019May 25, 2021 David Schor
MediaTek Announces The Helio P22, A New Premium Mid-Range SoC

MediaTek Announces The Helio P22, A New Premium Mid-Range SoC

May 25, 2018May 25, 2021 Matt Larson

ARM WorldView All

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor
Arm Introduces A New Big Core, The Cortex-A720
Architectures Desktop Processors Mobile Processors 

Arm Introduces A New Big Core, The Cortex-A720

May 28, 2023May 28, 2023 David Schor
Arm Launches Next-Gen Efficiency Core; Cortex-A520
Architectures Embedded Processors Mobile Processors 

Arm Launches Next-Gen Efficiency Core; Cortex-A520

May 28, 2023May 28, 2023 David Schor
Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor

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