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Latest:
  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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POWER9

Architectures Hot Chips 31 Interconnects Server Processors 

IBM Adds POWER9 AIO, Pushes for an Open Memory-Agnostic Interface

November 3, 2019May 25, 2021 David Schor Centaur (buffer chip), Hot Chips 31, IBM, NVLink, Open Memory Interface (OMI), open source, OpenCAPI, Power ISA, POWER9

IBM adds a third variant of POWER9, the POWER9 Advanced I/O (AIO) processor which incorporates the Open Memory Interface (OMI), a new open memory-agnostic interface.

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Architectures OpenPOWER Summit Roadmaps Server Processors 

IBM Open Sources Power ISA, Delays POWER10 to 2021

September 12, 2019May 25, 2021 David Schor IBM, OpenPOWER, OpenPOWER Summit, OpenPOWER Summit 2019, POWER, Power ISA, POWER10, POWER9, PowerAXON

At the recent OpenPOWER Summit, IBM outlined their new roadmap, open-sourced the Power ISA, and made a number of additional announcements.

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Architectures Floorplanning Hot Chips 30 Interconnects Server Processors 

POWER9 Scales Up To 1.2 TB/s of I/O, Targets NVLink 3, OpenCAPI Memory for 2019

October 7, 2018May 25, 2021 David Schor 14 nm, 14HP, A-Bus, Centaur, Hot Chips, Hot Chips 30, IBM, NVLink, OpenCAPI, POWER, Power ISA, POWER9, PowerAXON, X-Bus

A look at the IBM POWER9 scale-up design recently disclosed at Hot Chips 30 and their plans for a 3rd POWER9 derivative for 2019.

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Top Six Articles

  • TSMC N3, And Challenges Ahead
  • A Look At Qualcomm’s Data Center Inference Accelerator
  • IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV
  • Arm’s New Cortex-M55 Breathes Helium
  • Arm Launches Next-Gen Flagship Cortex-X925
  • IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

Qualcomm launches the Centriq 2400 server family

Qualcomm launches the Centriq 2400 server family

November 8, 2017May 25, 2021 David Schor
A Look at Cerebras Wafer-Scale Engine: Half Square Foot Silicon Chip

A Look at Cerebras Wafer-Scale Engine: Half Square Foot Silicon Chip

November 16, 2019May 25, 2021 David Schor
CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

CEA-Leti Demos a 6-Chiplet 96-Core 3D-Stacked MIPS Processor

March 1, 2020May 25, 2021 David Schor
A Look at NEC’s Latest Vector Processor, the SX-Aurora

A Look at NEC’s Latest Vector Processor, the SX-Aurora

December 9, 2018May 25, 2021 David Schor
Intel to launch Skylake-D in Q1 2018, followed by Xeons with integrated FPGA

Intel to launch Skylake-D in Q1 2018, followed by Xeons with integrated FPGA

November 26, 2017May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

The Mesh Network For Next-Generation Neoverse Chips

The Mesh Network For Next-Generation Neoverse Chips

May 22, 2021May 23, 2021 David Schor
Intel discloses Tremont, a Goldmont Plus successor

Intel discloses Tremont, a Goldmont Plus successor

April 4, 2018May 25, 2021 David Schor
Inside Baidu’s In-House Neural Processor

Inside Baidu’s In-House Neural Processor

July 11, 2021July 12, 2021 David Schor
A Look At Samsung’s 4LPE Process

A Look At Samsung’s 4LPE Process

June 26, 2022June 26, 2022 David Schor
AMD 3D Stacks SRAM Bumplessly

AMD 3D Stacks SRAM Bumplessly

June 7, 2021June 7, 2021 David Schor
Intel Launches 10th Gen Ice Lake Lineup: 11 New Mobile Chips

Intel Launches 10th Gen Ice Lake Lineup: 11 New Mobile Chips

August 1, 2019May 25, 2021 David Schor
Intel Expands 22FFL With Production-Ready RRAM and MRAM on FinFET

Intel Expands 22FFL With Production-Ready RRAM and MRAM on FinFET

October 18, 2019May 25, 2021 David Schor

ARM WorldView All

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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