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Samsung 17nm follows Intel 16
Reincarnating The 6502 Using Flexible TFT Tech For IoT
Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC
Samsung-Esperanto Concept AI-SSD Prototype
EUV State, NXE:3600D, and Pellicle Readiness and Industrialization

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Recent

Samsung 17nm follows Intel 16
May 22, 2022May 22, 2022 David Schor
Reincarnating The 6502 Using Flexible TFT Tech For IoT
May 8, 2022May 8, 2022 David Schor
Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC
February 20, 2022February 21, 2022 David Schor
Samsung-Esperanto Concept AI-SSD Prototype
November 21, 2021November 21, 2021 David Schor
EUV State, NXE:3600D, and Pellicle Readiness and Industrialization
November 20, 2021November 20, 2021 David Schor
Intel Launches 12th Gen Core Desktop Alder Lake Processors
October 27, 2021November 3, 2021 David Schor

Random Picks

Intel Introduces Co-EMIB To Stitch Multiple 3D Die Stacks Together, Adds Omni-Directional Interconnects

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x86 WorldView All

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Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

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Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Architectures Server Processors

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

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Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

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Random

AMD Announces 3rd Gen Ryzen Threadripper

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Radeon RX 5700: Navi and the RDNA Architecture

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Intel Expands 22FFL With Production-Ready RRAM and MRAM on FinFET

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VLSI 2018: Samsung’s 8nm 8LPP, a 10nm extension

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IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery

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ARM WorldView All

Architectures Server Processors

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor

Data Processing Unit

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor

Architectures

Arm Introduces Its Confidential Compute Architecture

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IEDM 2020 Interconnects Packaging Subscriber Only Content

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor

Architectures Interconnects Network-on-Chip

Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

May 25, 2021May 25, 2021 David Schor

Architectures Interconnects Mobile Processors

Arm Launches The DSU-110 For New Armv9 CPU Clusters

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