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A Look at NEC’s Latest Vector Processor, the SX-Aurora

December 9, 2018May 25, 2021 David Schor 16nm, 3D packaging, HBM2, interposer, multi-chip package, NEC, Packaging, SIMD, SX series, SX-Aurora, vector processors

A look at the NEC SX-Aurora, their latest vector processor – increasing compute while maintaining a high B/F through six HBM2 modules leveraging TSMC 2nd gen CoWoS technology. The SX-Aurora introduces a new form factor, system architecture, and execution model.