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Thursday, March 23, 2023
Latest:
  • A Look At AMD’s 3D-Stacked V-Cache
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications
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Xeon E

Desktop Processors Server Processors 

Intel Launches Desktop Xeon E, Their Fastest Entry-Level Workstation Processors

July 13, 2018May 25, 2021 David Schor Coffee Lake, Coffee Lake E, Intel, x86, Xeon E, Xeon E3

Intel has launched their fastest entry-level workstation microprocessors based on Coffee Lake.

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Desktop Processors Mobile Processors 

Intel unleashes 8th Gen Core Coffee Lake lineup

April 3, 2018May 25, 2021 David Schor 14 nm, Coffee Lake, Core i3, Core i5, Core i7, Intel, x86, Xeon E

Intel unveils the full 8th Generation Core desktop and mobile microprocessors lineup based on their latest Coffee Lake microarchitecture.

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Desktop Processors Mobile Processors 

8th Gen Coffee Lake and 9th Gen Lineup

November 24, 2017May 25, 2021 David Schor Coffee Lake, Core i3, Core i5, Core i7, Ice Lake, Intel, x86, Xeon E

The rest of the Coffee Lake lineup as well as what appears to be Ice Lake lineup has been revealed by the AIDA64 changelog. The list includes a flagship mobile Core i9 processor and 9th generation Ice Lake SKUs.

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Top Six Articles

  • A Look At Intel 4 Process Technology
  • IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects
  • IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery
  • Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A
  • Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process
  • GlobalFoundries 14HP process, a marriage of two technologies

Recent

  • A Look At AMD’s 3D-Stacked V-Cache

    A Look At AMD’s 3D-Stacked V-Cache

    December 27, 2022December 27, 2022 David Schor
  • IEDM 2022: Did We Just Witness The Death Of SRAM?

    IEDM 2022: Did We Just Witness The Death Of SRAM?

    December 14, 2022December 15, 2022 David Schor
  • SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

    SiFive Announces New Cores, BiFurcates Line Into Performance And Efficiency Cores

    November 1, 2022November 2, 2022 David Schor
  • Intel, SiFive Demo High-Performance  RISC-V Horse Creek Dev Platform On Intel 4 Process

    Intel, SiFive Demo High-Performance RISC-V Horse Creek Dev Platform On Intel 4 Process

    October 7, 2022October 7, 2022 David Schor
  • TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    TSMC Demos SoIC_H for High-Bandwidth HPC Applications

    October 4, 2022October 4, 2022 David Schor
  • Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    Intel Rolls Out 13th Gen Core, Raptor Lake Processors; Cranks Up The Frequency

    October 1, 2022October 3, 2022 David Schor

Random Picks

Samsung quietly unveils their latest flagship processor: Exynos 9 Series 9810

Samsung quietly unveils their latest flagship processor: Exynos 9 Series 9810

November 10, 2017May 25, 2021 David Schor
QUEST, A TCI-Based 3D-Stacked SRAM Neural Processor

QUEST, A TCI-Based 3D-Stacked SRAM Neural Processor

April 25, 2018May 25, 2021 David Schor
TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

TSMC Ramps 5nm, Discloses 3nm to Pack Over a Quarter-Billion Transistors Per Square Millimeter

April 17, 2020May 25, 2021 David Schor
Hot Chips 30: Intel Kaby Lake G

Hot Chips 30: Intel Kaby Lake G

September 9, 2018May 25, 2021 David Schor
TSMC Demos SoIC_H for High-Bandwidth HPC Applications

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel Intel 7 ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Sunny Cove Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging

ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging

March 24, 2018May 25, 2021 David Schor
ISSCC 2018: MIT’s low-power hardware crypto RISC-V IoT processor

ISSCC 2018: MIT’s low-power hardware crypto RISC-V IoT processor

March 17, 2018May 25, 2021 David Schor
ISSCC 2018: Intel’s Self-Powered Intelligent IoT Edge Mote

ISSCC 2018: Intel’s Self-Powered Intelligent IoT Edge Mote

April 2, 2018May 25, 2021 David Schor
ISSCC 2018: Intel’s Skylake-SP Mesh and  Floorplan

ISSCC 2018: Intel’s Skylake-SP Mesh and Floorplan

March 9, 2018May 25, 2021 David Schor
TSMC Demos SoIC_H for High-Bandwidth HPC Applications

TSMC Demos SoIC_H for High-Bandwidth HPC Applications

October 4, 2022October 4, 2022 David Schor
Inside PFN’s AI Processor And The World’s Most Power-Efficient Supercomputer

Inside PFN’s AI Processor And The World’s Most Power-Efficient Supercomputer

September 20, 2021September 20, 2021 David Schor
AMD’s Zen CPU Complex, Cache, and SMU

AMD’s Zen CPU Complex, Cache, and SMU

April 18, 2018May 25, 2021 David Schor

ARM WorldView All

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency
Architectures Mobile Processors 

Arm Refreshes The Cortex-A510, Squeezes Higher Efficiency

June 28, 2022June 28, 2022 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3
Mobile Processors 

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Arm Introduces The Cortex-A715
Architectures Mobile Processors 

Arm Introduces The Cortex-A715

June 28, 2022June 29, 2022 David Schor
Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip
Architectures Server Processors 

Alibaba Open Source XuanTie RISC-V Cores, Introduces In-House Armv9 Server Chip

October 20, 2021October 20, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration
Data Processing Unit 

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor
Arm Introduces Its Confidential Compute Architecture
Architectures 

Arm Introduces Its Confidential Compute Architecture

June 23, 2021June 23, 2021 David Schor

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