Hot Chips 33 Program: Alder Lake, Sapphire Rapids, Zen 3, Next-Gen Z, Neoverse N2, And Many More

The IEEE Symposium on High-Performance Chips Program Committee unveiled today the program for its Hot Chips 33 conference. Due to the ongoing COVID-19 pandemic, the conference will remain in virtual form and be held from Sunday, August 22 to Tuesday, August 24, 2021. The conference comprises three days – Tutorials on the first day followed by two days of technical sessions.

Tutorials

Sunday, August 22 is dedicated to tutorials. There are two tutorials, one focusing on machine learning performance while the other one discusses advanced packaging.

Tutorial 1: ML Performance and Real World Applications
Machine learning is a rich, varied, and rapidly evolving field. This tutorial will explore the applications, performance characteristics, and key challenges of many different unique workloads across training and inference. In particular, we will focus on hardware/software co-optimization for the industry-standard MLPerf™ benchmarks and selected applications and considerations at prominent cloud players.
Tutorial 2: Advanced Packaging
This tutorial will discuss advanced packaging technologies that enable performance and density improvements. Descriptions of the technologies and how they are used in cutting edge applications will be made by industry leaders in packaging and chip design.

Conference Day 1

Technical sessions Day 1 start on Monday, August 23. Day 1 features 4 categories – Industry CPUs, Academic Spinout Chips, Infrastructure and Data Processors, and Technology Solutions. Additionally, there are two keynotes from Skydio and Synopsys.

CPUs
AMD	AMD Next Generation “Zen 3” Core
Intel	Intel Alder Lake CPU Architectures
	Next-Gen Intel Xeon CPU – Sapphire Rapids
IBM	The >5GHz next generation IBM Z processor chip

Academic Spinout Chips
UW–Madison	Mozart: Designing for Software Maturity and the Next Paradigm for Chip Architectures
UMich	Morpheus II: A RISC-V Security Extension for Protecting Vulnerable Software and Hardware

Infrastructure and Data Processors
ARM	Arm Neoverse N2: Arm’s second-generation high performance infrastructure CPUs and system products
Intel	Intel’s Hyperscale-Ready SmartNIC for Infrastructure Processing
NVIDIA	NVIDIA DATA Center Processing Unit (DPU) Architecture

Enabling Technologies
EdgeQ	Architecting an Open RISC-V 5G and AI SoC for Next Generation 5G Open Radio Access Network
Infineon	Heterogeneous computing to enable the highest level of safety in automotive systems
Samsung	Aquabolt-XL: Samsung HBM2-PIM with in-memory processing for machine learning accelerators

Conference Day 2

Technical sessions Day 2 start on Monday, August 23. Day 2 includes presentations from 4 additional categories – ML Inference for the Cloud, ML and Computation Platforms, Graphics and Video, and New Technologies. There is also an additional keynote by Dimitri Kusnezov, Deputy Under Secretary for AI and Technology, Department of Energy.

ML Inference for the Cloud
Enflame	AI Compute Chip from Enflame
Esperanto	Accelerating ML Recommendation with over a Thousand RISC-V/Tensor Processors on Esperanto’s ET-SoC-1 Chip
Qualcomm	Qualcomm Cloud AI 100: 12 TOPs/W Scalable, High Performance and Low Latency Deep Learning Inference Accelerator

ML and Computation Platforms
Cerebras	The Multi-Million Core, Multi-Wafer AI Cluster
D.E. Shaw Research	The Anton 3 ASIC: a Fire-Breathing Monster for Molecular Dynamics Simulations
Graphcore	Graphcore Colossus Mk2 IPU
SambaNova	SambaNova SN10 RDU: Accelerating Software 2.0 with Dataflow

Graphics and Video
AMD	AMD RDNA(TM) 2 Graphics Architecture
Google	Google’s Video Coding Unit (VCU) Accelerator
Intel	Intel’s Ponte Vecchio GPU Architecture
Xilinx	Xilinx 7nm Edge Processors

New Technologies
IonQ	The IonQ Trapped Ion Quantum Computer Architecture
Kagawa University	New Value Creation by Nano-Tactile Sensor Chip Exceeding our Fingertip Discrimination Ability
Mojo Vision	Mojo Lens – AR Contact Lenses for Real People
Samsung	World Largest Mobile Image Sensor with All Directional Phase Detection Auto Focus Function

Hot Chips 33 registration is open. Since the conference is virtual, registration fees are extremely reasonable ($125 for non-IEEE members and $50 for non-IEEE student members) and – as always – WikiChip encourages anyone interested to attend the conference as the presentations are always well-made and interesting. Registration can be done via the Hot Chips website here.