IEDM 2017: AMD’s grand vision for the future of HPC David SchorIEDM 2017, ProcessorsDecember 5, 2017 Tagged 2.5D packaging, 3D packaging, AMD, HBM, IEDM, IEDM 2017, Moore's Law, Packaging Capping off a great year, AMD CEO Lisa Su opening address at IEDM 2017 highlighted key challenges for the future, predicting a paradigm shift in the design of processors and systems that will deliver another decade of performance gains. Pages: 1 2 3 4 Read more
