Radio Frequency

IEDM 2017 Process Technologies

IEDM 2017: Intel details 22FFL, a relaxed 14nm process for foundry customers, targets mobile and RF apps

December 15, 2017May 25, 2021 David Schor 14 nm, 22 nm, 22FFL, ASIC, FinFET, IEDM, IEDM 2017, Intel, Intel Custom Foundry, Interconnect, process technology, Radio Frequency

At the 2017 IEDM Intel detailed their 22FFL process, a relaxed 14nm process for Intel’s custom foundry customers. 22FFL was optimized for mobile, IoT, and RF applications offering a cost competitive process with excellent performance and simple design rules.