TCI – WikiChip Fuse

QUEST, A TCI-Based 3D-Stacked SRAM Neural Processor

April 25, 2018May 25, 2021 David Schor 3D packaging, 40 nm, 40LP, AI, die stacking, Hokkaido University, ISSCC, ISSCC 2018, Keio University, neural processors, process technology, TCI, ThruChip Interface, TSMC, TSV

Attempting to address the memory bandwidth problem, the QUEST neural processor uses 3D-stacked SRAM dies along with ThruChip Interface wireless communication technology to deliver sufficiently high bandwidth to sustain peak processing performance.