12LP

IEDM 2020 Interconnects Packaging Subscriber Only Content 

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

David Schor , , , , , , , , , , , ,

With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.

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Architectures Interconnects Packaging Process Technologies 

GlobalFoundries, Arm Demonstrate High-Density 3D Stacked Mesh Interconnect for HPC Applications

David Schor , , , , , , , , ,

GlobalFoundries and Arm demonstrate a 3D mesh interconnect design using highly-dense hybrid bonding 3D stacking technology intended for HPC applications.

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