Hot Chips 30: Intel Kaby Lake G
A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.
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2.5D packaging
IEDM 2017: AMD’s grand vision for the future of HPC
Capping off a great year, AMD CEO Lisa Su opening address at IEDM 2017 highlighted key challenges for the future, predicting a paradigm shift in the design of processors and systems that will deliver another decade of performance gains.
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