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IEDM 2017 Processors

IEDM 2017: AMD’s grand vision for the future of HPC

December 5, 2017May 25, 2021 David Schor 2.5D packaging, 3D packaging, AMD, HBM, IEDM, IEDM 2017, Moore's Law, Packaging

Capping off a great year, AMD CEO Lisa Su opening address at IEDM 2017 highlighted key challenges for the future, predicting a paradigm shift in the design of processors and systems that will deliver another decade of performance gains.