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Thursday, November 21, 2024

Latest:

Arm Launches Next-Gen Big-Core: Cortex-A725
Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
Arm Launches Next-Gen Flagship Cortex-X925
Amazon Debuts 4th Gen Graviton
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

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Kaby Lake G

Circuit Design Hot Chips 30 Packaging

Hot Chips 30: Intel Kaby Lake G

September 9, 2018May 25, 2021 David Schor 14 nm, 2.5D packaging, 3D packaging, AMD, CPU, EMIB, GPU, Intel, Kaby Lake, Kaby Lake G, multi-chip package, Radeon Vega, x86

A look at Intel’s current generation of Thin & Light processors with high-performance graphics, formerly known as Kaby Lake G, from Hot Chips 30.

Top Six Articles

A Look At Intel 4 Process Technology
OCP Bunch of Wires: A New Open Chiplets Interface For Organic Substrates
Inside Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era Interconnect
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
TSMC N3, And Challenges Ahead
Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

Recent

Arm Launches Next-Gen Big-Core: Cortex-A725
May 29, 2024May 29, 2024 David Schor
Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
May 28, 2023May 28, 2023 David Schor

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July 21, 2019May 25, 2021 David Schor

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ISSCC 2018: Intel’s Skylake-SP Mesh and Floorplan

March 9, 2018May 25, 2021 David Schor

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May 3, 2019May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

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Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Architectures Server Processors

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor

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Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

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Intel discloses Tremont, a Goldmont Plus successor

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Hot Chips 30: Nvidia Xavier SoC

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Intel axes Knights Hill, plans a new microarchitecture for exascale

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OCP Makes a Push for an Open Chiplet Marketplace

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Samsung-Esperanto Concept AI-SSD Prototype

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ARM WorldView All

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Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor

Architectures Desktop Processors Embedded Processors Mobile Processors

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor

Architectures Desktop Processors Server Processors

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor

Server Processors

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor

Embedded Processors Mobile Processors

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor

Architectures Desktop Processors Mobile Processors Server Processors

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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