45 nm

Architectures Circuit Design Hot Chips 31 Interconnects Packaging

Ayar Labs Realizes Co-Packaged Silicon Photonics

January 19, 2020May 25, 2021 David Schor 45 nm, 45RFSOI, Ayar Labs, chiplet, GlobalFoundries, GlobalFoundries Technology Conference (GTC), Hot Chips, Hot Chips 31, Intel, multi-chip package, Photonics, silicon photonics, Stratix 10, TeraPHY

Integrated photonics has long been considered a holy grail for communication. Ayar Labs TeraPHY chiplet represents a major step forward through the co-packaging of the optical interface along with an SoC.

45 nm

Photonics Chiplet Inches Towards Production

Ayar Labs Realizes Co-Packaged Silicon Photonics

DARPA ERI: How Ayar Labs Collaboration With GF Produces A Photonics Chiplet That Can Supercharge Intel FPGAs