VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers
A preview of some of the process technology papers from next week’s VLSI Symposium.
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FinFET
GlobalFoundries 14HP process, a marriage of two technologies
As IBM starts shipping their latest server microprocessors we take a look at the process technology that’s enabling those capabilities. Though largely thought to be the same as the original process IBM detailed back in 2014, following their fab selloff the process has undergone some unique changes making it a distinctly GlobalFoundries process now.
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IEDM 2017 + ISSCC 2018: Intel’s 10nm, switching to cobalt interconnects
At IEDM 2017 and ISSCC 2018 Intel detailed their upcoming 10nm node, an aggressively scaled 7nm-class process technology that features new scaling accelerators as well as cobalt interconnect for the first time in high-volume manufacturing.
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IEDM 2017: GlobalFoundries 7nm process; Cobalt, EUV
At the 2017 IEDM GlobalFoundries detailed their 7nm Leading Performance (7LP) process, an aggressively scaled version of their 14nm process optimized for next-generation mobile, SoC, and high-performance applications.
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IEDM 2017: Intel details 22FFL, a relaxed 14nm process for foundry customers, targets mobile and RF apps
At the 2017 IEDM Intel detailed their 22FFL process, a relaxed 14nm process for Intel’s custom foundry customers. 22FFL was optimized for mobile, IoT, and RF applications offering a cost competitive process with excellent performance and simple design rules.
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