IEDM 2020

IEDM 2020 Interconnects Packaging Subscriber Only Content

A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

June 11, 2021June 11, 2021 David Schor 12 nm, 12LP, 3D packaging, ARM, CMN-600, die stacking, Direct Bond Interconnect (DBI), GlobalFoundries, hybrid bonding, IEDM, IEDM 2020, subscriber only (general), Trishul (Arm test chip)

With hybrid bonding inching towards production, here’s a look at Trishul, Arm’s first exploratory test chip – in collaboration with GlobalFoundries – that demonstrates the feasibility of high-density 3D stacking using Arm’s CoreLink CMN-600 extended to 3D.

IEDM 2020

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A Look At Trishul: Arm’s First High-Density 3D Logic Stacked Test-Chip

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