Intel’s Diamond Mesa Bridges The Gap Between ASIC and FPGA
With Intel’s acquisition of eASIC in 2018, the company’s latest product – codenamed Diamond Mesa – attempts to bridge the gap between full ASIC and FPGAs.
Read moreWith Intel’s acquisition of eASIC in 2018, the company’s latest product – codenamed Diamond Mesa – attempts to bridge the gap between full ASIC and FPGAs.
Read moreIntel launches the industry’s highest-capacity FPGA; 10-million LEs comprising two large FPGA dies interconnected using the company’s 2.5D EMIB packaging technology.
Read moreIntel launches a new Stratix 10 family bringing new support for PCIe Gen 4.0, new cache-coherency support, and Optane DC DIMM support.
Read moreFrom a DARPA vision and a $15 million seed to a commercialized CMOS silicon photonics product: how Ayar Labs collaboration with GF produces a photonics chiplet that can supercharge Intel FPGAs.
Read moreIntel has introduced their next-generation flagship data center FPGAs based on their 10-nanometer process. Utilizing a chiplet-based architecture, the company hopes to better customize the product for customer’s demand while iterating faster on PHYs and other connectivity protocols.
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