Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Intel’s Gracemont small core eclipses last-generation Skylake big core performance and energy efficiency
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Tremont
Intel Launches Lakefield: An Experiment With Multiple New Technologies
Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future.
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A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC
A look at Lakefield, Intel’s new mobile-class heterogeneous penta-core SoC built using two dies 3D-stacked face-to-face using the company Foveros packaging technology.
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Intel Unveils the Tremont Microarchitecture: Going After ST Performance
Intel unveils the Tremont microarchitecture, its next-generation low-power small x86 core.
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Intel Reveals 10nm Sunny Cove Core, a New Core Roadmap, and Teases Ice Lake Chips
Last week Intel disclosed initial details of their next-generation core microarchitecture, Sunny Cove, which will make it into future Ice Lake client and server chips among other products.
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Intel discloses Tremont, a Goldmont Plus successor
Intel has disclosed a new “Tremont” microarchitecture along with the release of their latest architecture ISA programming reference.
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