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Latest:
  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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5LPE

Foundries Process Technologies Roadmaps 

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor 2 nm, 3 nm, 3GAAE, 3GAAP, 3GAE, 3GAP, 5LPE, GAAFET, nanosheet, Samsung, Samsung Foundry

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

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Foundries IEDM 2020 Process Technologies Roadmaps Subscriber Only Content 

Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year

May 21, 2021June 24, 2021 David Schor 3 nm, 4 nm, 4LPE, 4LPP, 5 nm, 5LPE, 5LPP, 7 nm, IEDM 2020, Samsung, Samsung Foundry, subscriber only (general)

Samsung revealed more details of its 5LPE process technology which recently ramped, gave a roadmap status update along with new stop-gap nodes announcement.

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ARM TechCon 2019 Process Technologies Roadmaps 

Samsung 5 nm and 4 nm Update

October 19, 2019May 25, 2021 David Schor 4LPE, 4nm, 5LPE, 5nm, Samsung

Update and analysis of Samsung’s upcoming 5-nanometer and 4-nanometer process technologies.

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ARM TechCon 2018 Foundries Packaging Process Technologies 

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

October 28, 2018May 25, 2021 David Schor 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.

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Top Six Articles

  • Huawei Expands Kunpeng Server CPUs, Plans SMT, SVE For Next Gen
  • TSMC N3, And Challenges Ahead
  • TSMC Details 5 nm
  • Ayar Labs Realizes Co-Packaged Silicon Photonics
  • Arm Makes Headway In HPC, Cloud
  • A look at Nvidia’s NVLink interconnect and the NVSwitch

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

Bitcoin giant Bitmain enters the AI market with the BM1680 neural processor

Bitcoin giant Bitmain enters the AI market with the BM1680 neural processor

November 8, 2017May 25, 2021 David Schor
Centaur New x86 Server Processor Packs an AI Punch

Centaur New x86 Server Processor Packs an AI Punch

January 24, 2020May 25, 2021 David Schor
Fujitsu Semi Sells 300mm Mie Fabs

Fujitsu Semi Sells 300mm Mie Fabs

June 29, 2018May 25, 2021 David Schor
IEDM 2022: Did We Just Witness The Death Of SRAM?

IEDM 2022: Did We Just Witness The Death Of SRAM?

December 14, 2022December 15, 2022 David Schor
Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

Arm Launches New Coherent And SoC Interconnects: CI-700 & NI-700

May 25, 2021May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Marvell Lays Out ARM Server Roadmap

Marvell Lays Out ARM Server Roadmap

November 9, 2019May 25, 2021 David Schor
Nvidia Inference Research Chip Scales to Dozens of Chiplets

Nvidia Inference Research Chip Scales to Dozens of Chiplets

June 30, 2019May 25, 2021 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
PEZY dominates the new Green500 list

PEZY dominates the new Green500 list

November 13, 2017May 25, 2021 David Schor
Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements

July 5, 2022July 5, 2022 David Schor
Intel silently launches Knights Mill

Intel silently launches Knights Mill

December 18, 2017May 25, 2021 David Schor
Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

Marvell Launches 5nm Octeon 10 DPUs with Neoverse N2 cores, AI Acceleration

June 28, 2021June 28, 2021 David Schor

ARM WorldView All

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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