Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Intel unveiled Alder Lake, the company’s next-generation mainstream heterogeneous multi-core SoC for mobile through desktop
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Intel
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Intel details Golden Cove, the company’s next-generation big core for client and server SoCs
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Intel Unveils Foveros Omni And Foveros Direct; Leveraging Hybrid Bonding
Intel unveils the Foveros Omni and Foveros Direct packaging technologies; which will be leveraging multiple base dies and hybrid bonding
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Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A
Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A
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Intel Announces 20Å Node: RibbonFET Devices, PowerVia, 2024 Ramp
Intel announces Intel 20Å Node which will feature RibbonFET devices, PowerVia, and is set to ramp 2024.
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Intel Talks 10nm DTCO, EUV Benefits
Intel talks 10-nanometers DTCO and the benefits of EUV on their future 7 nm and 5 nm nodes.
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Intel’s Diamond Mesa Bridges The Gap Between ASIC and FPGA
With Intel’s acquisition of eASIC in 2018, the company’s latest product – codenamed Diamond Mesa – attempts to bridge the gap between full ASIC and FPGAs.
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Q1 2021 Foundry Update: Spending Bonanza
A look at the current state of leading-edge foundries for the first quarter of 2021.
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Hot Chips 33 Program: Alder Lake, Sapphire Rapids, Zen 3, Next-Gen Z, Neoverse N2, And Many More
The IEEE Symposium on High-Performance Chips Program Committee announced the program for the 2021 Hot Chips 33 conference.
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Intel Pushes Out Flagship Premium Tiger Lake Mobile Chips
In rolls out flagship premium performance 11th Generation Core Tiger Lake-based mobile processors with eight cores.
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