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  • Arm Launches Next-Gen Big-Core: Cortex-A725
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925
  • Arm Launches Next-Gen Flagship Cortex-X925
  • Amazon Debuts 4th Gen Graviton
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
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Samsung

Architectures Mobile Processors 

Samsung Discloses Exynos M4 Changes, Upgrades Support for ARMv8.2, Rearranges The Back-End

January 14, 2019May 25, 2021 David Schor 8LPP, ARM, ARMv8, ARMv8.2, Exynos, Samsung

Samsung details the initial changes to the Exynos M4 core found in the Exynos 9820 which will be in Samsung’s next-generation Galaxy S10 smartphone.

Read more
Foundries Process Technologies Roadmaps Server Processors 

IBM Chooses Samsung 7nm EUV for Next-Gen POWER and Z Microprocessors

December 20, 2018May 25, 2021 David Schor 7LPP, 7nm, Common Platform Alliance, EUV, IBM, POWER, Power ISA, POWER10, Samsung, Z

IBM partners up with Samsung 7nm EUV process for their next-generation of POWER and Z microprocessors.

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ARM TechCon 2018 Foundries Packaging Process Technologies 

Samsung 7nm Enters Risk Production, Talks Roadmap, Scaling Boosters, and the ARM Ecosystem

October 28, 2018May 25, 2021 David Schor 2.5D packaging, 3D packaging, 3GAAE, 3GAAP, 3GAE, 3nm, 4LPE, 4LPP, 5LPE, 5nm, 7LPP, 7nm, EUV, Packaging, Samsung

Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.

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Process Technologies VLSI 2018 

VLSI 2018: Samsung’s 2nd Gen 7nm, EUV Goes HVM

August 4, 2018May 25, 2021 David Schor 7LPP, 7nm, EUV, process technology, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 2nd generation 7nm process that was recently disclosed at the 38th Symposium on VLSI Technology.

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Process Technologies VLSI 2018 

VLSI 2018: Samsung’s 8nm 8LPP, a 10nm extension

July 1, 2018May 25, 2021 David Schor 10LPE, 10LPP, 10nm, 8LPP, 8nm, FinFET, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 8nm 8LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.

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Process Technologies VLSI 2018 

VLSI 2018: Samsung’s 11nm nodelet, 11LPP

June 30, 2018May 25, 2021 David Schor 10 nm, 11 nm, 11LPP, 14 nm, FinFET, Samsung, VLSI 2018, VLSI Symposium

A look at Samsung’s 11nm 11LPP process that was recently disclosed at the 38th Symposium on VLSI Technology.

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VLSI 2018 

VLSI 2018: Next Week’s Samsung and GlobalFoundries Papers

June 17, 2018May 25, 2021 David Schor 10 nm, 14 nm, 7 nm, 8 nm, FinFET, GlobalFoundries, Qualcomm, Samsung, VLSI 2018, VLSI Symposium

A preview of some of the process technology papers from next week’s VLSI Symposium.

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Process Technologies 

Samsung 2nd gen 10nm enters HVM, S3 fab ready for primetime

November 29, 2017May 25, 2021 David Schor 10LPP, 10nm, 7LPP, 7nm, 8LPP, 8nm, EUV, Samsung

Samsung has announced that its 2nd generation 10nm process has entered mass production. The company also announced that their S3-Line fab in South Korea is ready to ramp up production.

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Mobile Processors 

Samsung quietly unveils their latest flagship processor: Exynos 9 Series 9810

November 10, 2017May 25, 2021 David Schor 10LPP, 10nm, ARM, Exynos, Samsung

Samsung has quietly unveiled its latest flagship processor, the Exynos 9 Series 9810, which will succeed the Exynos 9 Series 8895 found in the Galaxy S8, S8+, and the Note 8.

Read more
  • Next →

Top Six Articles

  • IEDM 2018: Intel’s 10nm Standard Cell Library and Power Delivery
  • A Look At Intel 4 Process Technology
  • Samsung 3nm GAAFET Enters Risk Production; Discusses Next-Gen Improvements
  • Samsung 5 nm and 4 nm Update
  • IEDM 2022: Did We Just Witness The Death Of SRAM?
  • A Look at Cerebras Wafer-Scale Engine: Half Square Foot Silicon Chip

Recent

  • Arm Launches Next-Gen Big-Core: Cortex-A725

    Arm Launches Next-Gen Big-Core: Cortex-A725

    May 29, 2024May 29, 2024 David Schor
  • Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925

    Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

    May 29, 2024May 29, 2024 David Schor
  • Arm Launches Next-Gen Flagship Cortex-X925

    Arm Launches Next-Gen Flagship Cortex-X925

    May 29, 2024May 29, 2024 David Schor
  • Amazon Debuts 4th Gen Graviton

    Amazon Debuts 4th Gen Graviton

    December 8, 2023December 9, 2023 David Schor
  • Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

    November 22, 2023November 22, 2023 David Schor
  • Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

    May 28, 2023May 28, 2023 David Schor

Random Picks

UMC Rolls Out 22-Nanometer

UMC Rolls Out 22-Nanometer

December 13, 2019May 25, 2021 David Schor
VLSI 2018: Samsung’s 11nm nodelet, 11LPP

VLSI 2018: Samsung’s 11nm nodelet, 11LPP

June 30, 2018May 25, 2021 David Schor
TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications

TSMC Announces 2x Reticle CoWoS For Next-Gen 5nm HPC Applications

March 3, 2020May 25, 2021 David Schor
Chuck Peddle: Personal Computer Pioneer, Dies At 82

Chuck Peddle: Personal Computer Pioneer, Dies At 82

December 24, 2019May 25, 2021 David Schor
Zhaoxin Unveiled Next-Generation x86 SoC Plans: 32-Core Servers, Sub-7nm Client Designs

Zhaoxin Unveiled Next-Generation x86 SoC Plans: 32-Core Servers, Sub-7nm Client Designs

December 12, 2019May 25, 2021 David Schor

Random Tags

2.5D packaging 3 nm 3D packaging 5 nm 5nm 7 nm 7nm 10 nm 10nm 14 nm 16nm AI AMD ARM ARMv8 ARMv9 chiplet Coffee Lake Core i5 Core i7 Cortex Cortex-A edge computing EMIB EUV FinFET GlobalFoundries Hot Chips IBM Ice Lake IEDM inference Intel ISSCC multi-chip package neural processors process technology RISC-V Samsung subscriber only (general) Supercomputers TSMC VLSI Symposium x86 Zen

x86 WorldView All

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling
Desktop Processors Mobile Processors 

Intel Introduces Thread Director For Heterogeneous Multi-Core Workload Scheduling

August 19, 2021August 19, 2021 David Schor

Intel introduces the Intel Thread Director for heterogeneous multi-core workload scheduling

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs
Architectures Server Processors 

Intel Unveils Sapphire Rapids: Next-Generation Server CPUs

August 19, 2021August 19, 2021 David Schor
Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance
Architectures Data Processing Unit Desktop Processors Mobile Processors 

Intel’s Gracemont Small Core Eclipses Last-Gen Big Core Performance

August 19, 2021August 21, 2021 David Schor
Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC
Architectures Desktop Processors Mobile Processors 

Intel Unveils Alder Lake: Next-Generation Mainstream Heterogeneous Multi-Core SoC

August 19, 2021August 19, 2021 David Schor
Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs
Architectures Desktop Processors Mobile Processors Server Processors 

Intel Details Golden Cove: Next-Generation Big Core For Client and Server SoCs

August 19, 2021August 19, 2021 David Schor
Intel Launches 3rd Gen Ice Lake Xeon Scalable
Architectures Server Processors 

Intel Launches 3rd Gen Ice Lake Xeon Scalable

April 6, 2021May 23, 2021 David Schor

Random

Intel unleashes 8th Gen Core Coffee Lake lineup

Intel unleashes 8th Gen Core Coffee Lake lineup

April 3, 2018May 25, 2021 David Schor
Arm Launches The DSU-110 For New Armv9 CPU Clusters

Arm Launches The DSU-110 For New Armv9 CPU Clusters

May 25, 2021May 25, 2021 David Schor
Arm Unveils Next-Gen Flagship Core: Cortex-X3

Arm Unveils Next-Gen Flagship Core: Cortex-X3

June 28, 2022June 28, 2022 David Schor
Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

Intel 2021 Process Technology Update: Intel 7, Intel 4, Intel 3, and Intel 20A

July 26, 2021July 26, 2021 David Schor
Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

Intel 2020s Process Technology Roadmap: 10nm+++, 3nm, 2nm, and 1.4nm for 2029

December 10, 2019May 25, 2021 David Schor
Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

Intel Unveils BonanzaMine, A Bitcoin Accelerator ASIC

February 20, 2022February 21, 2022 David Schor
Arm Unveils Next-Gen Armv9 Big Core: Cortex-A710

Arm Unveils Next-Gen Armv9 Big Core: Cortex-A710

May 25, 2021May 25, 2021 David Schor

ARM WorldView All

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925,  Cortex-A725, Immortalis-G925
Architectures Desktop Processors Embedded Processors Mobile Processors Roadmaps 

Arm Unveils 2024 Compute Platform: 3nm, Cortex-X925, Cortex-A725, Immortalis-G925

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Big-Core: Cortex-A725
Architectures Desktop Processors Embedded Processors Mobile Processors 

Arm Launches Next-Gen Big-Core: Cortex-A725

May 29, 2024May 29, 2024 David Schor
Arm Launches Next-Gen Flagship Cortex-X925
Architectures Desktop Processors Server Processors 

Arm Launches Next-Gen Flagship Cortex-X925

May 29, 2024May 29, 2024 David Schor
Amazon Debuts 4th Gen Graviton
Server Processors 

Amazon Debuts 4th Gen Graviton

December 8, 2023December 9, 2023 David Schor
Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium
Embedded Processors Mobile Processors 

Arm Launches the Cortex-M52 For IoT; Its Smallest Processor with Helium

November 22, 2023November 22, 2023 David Schor
Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core
Architectures Desktop Processors Mobile Processors Server Processors 

Arm Introduces The Cortex-X4, Its Newest Flagship Performance Core

May 28, 2023May 28, 2023 David Schor

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