Intel to leverage EMIBs to create mobile processors with discrete AMD graphics

Intel has announced they will be introducing an 8th generation processor featuring a discrete AMD Radeon GPU along with HBM2. Using Intel’s new EMIB packaging interconnect technology, the single-chip solution provides higher performance while delivering a smaller form factor than comparable solutions.

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The 2,048-core PEZY-SC2 sets a Green500 record

PEZY-SC2 is PEZY’s newest 16nm a many-core processor featuring 2,048 cores that is powering the world’s most power-efficient supercomputer. The chip is the first to use a unique 3D packaging interconnect technology known as TCI in order to achieve a memory bandwidth of over 2 TB/s.

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