TOP500 50th List Anniversary: A Visualized Breakdown
TOP500.org is celebrating its 50th list anniversary. But what does the list actually looks like? We have compiled some statistics to give you an insight into the list.
Read moreTOP500.org is celebrating its 50th list anniversary. But what does the list actually looks like? We have compiled some statistics to give you an insight into the list.
Read moreIn preparation for the United States’ first exascale supercomputer, Intel announces they are cancelling next-generation Xeon Phi processors (codename Knights Hill) in favor of a brand new platform and microarchitecture specifically designed for exascale.
Read moreWith the newly published Green500 list, Japan dominates the most power-efficient supercomputer list thanks to the ZettaScaler-2.2 architecture and PEZY’s PEZY-SC2 many-core processor.
Read moreSilicon Lottery has published new statistics regarding the overclockability of Intel’s hexa-core Core i7-8700K desktop processor.
Read moreSamsung has quietly unveiled its latest flagship processor, the Exynos 9 Series 9810, which will succeed the Exynos 9 Series 8895 found in the Galaxy S8, S8+, and the Note 8.
Read moreThe ASIC Bitcoin design company Bitmain has announced they are entering the AI market with their new custom design BM1680 neural processor which will be at the heart of the new Sophon family of AI PCIe accelerator cards and full servers.
Read moreQualcomm launched their Centriq family of server microprocessors based on their ARM Falkor microarchitecture manufactured on Samsung’s 10nm process.
Read moreIntel has announced they will be introducing an 8th generation processor featuring a discrete AMD Radeon GPU along with HBM2. Using Intel’s new EMIB packaging interconnect technology, the single-chip solution provides higher performance while delivering a smaller form factor than comparable solutions.
Read morePEZY-SC2 is PEZY’s newest 16nm a many-core processor featuring 2,048 cores that is powering the world’s most power-efficient supercomputer. The chip is the first to use a unique 3D packaging interconnect technology known as TCI in order to achieve a memory bandwidth of over 2 TB/s.
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